Method for preparing local soft solder coating on surface of aluminum alloy

A technology of aluminum alloy surface and solder, applied in the field of materials, can solve the problems of pollution, low potential of aluminum electrodes, easy bubbling, etc., and achieve the effects of reducing production cost, reducing production cycle and simple preparation process
CN105014175AInactive Publication Date: 2015-11-04HARBIN INST OF TECH SHENZHEN GRADUATE SCHOOL +1
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
HARBIN INST OF TECH SHENZHEN GRADUATE SCHOOL
Publication Date
2015-11-04
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention relates to a method for preparing a local soft solder coating on the surface of aluminum alloy in the atmospheric environment under the low-temperature condition. According to the method, the local soft solder coating on the surface of aluminum or on the surface of aluminum alloy is prepared in the atmospheric environment under the low-temperature condition through the function of the ultrasonic phonochemistry. By the adoption of the method, the defect that a soft solder wetting coating on the surface of aluminum or the surface of aluminum alloy cannot be prepared easily is overcome. Compared with other coating techniques such as electroplating, the method has the advantages that the technique is simple; the manufacturing cost is low; no pollution is generated; and the local coating can be formed within an extremely short period of time.
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Description

technical field

[0001] The invention belongs to the technical field of materials, in particular to a method for preparing a local solder coating on the surface of an aluminum alloy. Background technique

[0002] Aluminum alloy has the advantages of small specific gravity, good thermal conductivity, and high cost performance. In the electronics industry, it mainly plays the role of mechanical support, electrical signal transmission, heat dissipation, electromagnetic field shielding, and circuit protection. In recent years, due to the continuous rise in copper prices, some copper components have gradually been replaced by aluminum alloys. From the perspective of manufacturing electronic products, aluminum alloys are required to have good weldability. The soldering solder commonly used in electronic packaging is difficult to wet and spread on aluminum alloys. Therefore, in the electronics manufacturing industry, the solderability of aluminum alloy components is improved by ele...

Claims

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