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Lightweight high-strength heat-insulation moisture-proof composite paper board

A high-strength, light-weight technology, applied in the direction of paper/cardboard layered products, synthetic resin layered products, packaging items, etc., can solve the problems of heavy weight and large volume, and achieve good cushioning properties and excellent barrier effects. Effect

Inactive Publication Date: 2015-11-04
HUNAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It is difficult to achieve the above performance with a simple board, and the combination of multi-layer boards to form a composite board will superimpose the performance of each board layer to achieve better performance
In the past composite boards, the most common composite method is the composite of each solid board, which is similar to the composite of multi-layer wood boards. However, although this composite method can provide greater strength, it is heavy and needs to achieve functions. sex requires more body

Method used

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  • Lightweight high-strength heat-insulation moisture-proof composite paper board
  • Lightweight high-strength heat-insulation moisture-proof composite paper board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] Reference figure 1, A light -quality high -intensity heat -heat insulation composite cardboard, which is compounded by multi -layer, includes elastic polystumin anti -rushing plates on the surface in turn 1. Anti -rushing fiber layer I2, honeycomb paper core 3 and bottom layer paper I4, environmental foam buffer buffer bufferLayer 5. Anti -rushing fiber layer II6, corrugated paper core 7 and bottom layer paper II8 and the bottom layer of polymapilic acid strength board 9.

[0031] The elastic polystumin anti -rushing plate 1 is the main raw material with polylactic acid, plant fiber, polycophactone, thermoplastic elastic body, and add a small amount of foam, compatible agent, plasticizer, waterproofing agent, antioxidant mixedAfter squeezing out the foaming.In the raw materials, the mass score of polymapilic acid is 45%, the mass score of plant fibers is 10%, the mass score of polycolins is 25%, and the mass score of the thermoplastic elastic body is 20%.

[0032] The mass ...

Embodiment 2

[0049] Reference figure 2 ., A light -quality high -intensity heat thermal insulation composite cardboard, which is compounded by multi -layer, includes the elastic polystraphic acid anti -rushing plate 1 'of the surface layer, I2' with anti -rushing fiber layer, honeycomb paper core 3 ', and bottom layer paper I4' i4 ', Environmental protection foam buffer layer 5, anti -rushing fiber layer II6 ', corrugated paper core 7', and bottom layer paper II8 'and the bottom layer of polymapilic acid strength board 9'.

[0050] The elastic polystumin anti -rushing plate 1 'is the main raw material with polylactic acid, plant fiber, polycophactone, and thermoplastic elastic body.After mixing, squeeze out the foam.In the raw materials, the mass score of polymapilic acid is 40%, the mass score of plant fibers is 15%, the mass score of polycolins is 25%, and the mass score of the thermoplastic elastic body is 20%.

[0051] The mass of the compatibility agent is 30%of the mass of polymapilic ac...

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Abstract

The invention relates to a lightweight high-strength heat-insulation moisture-proof composite paper board composited by multiple layers of boards and successively including a surface elastic polylactic acid antishock board, an antishock fiber layer I, a honeycomb paper core and a bottom facial paper I, an environmental-protection foamed buffer layer, an antishock fiber layer II, a corrugated paper core and a bottom facial paper II and a bottom polylactic acid strength board. The composite paper board is also characterized in that the inner surface of a space formed by the corrugated paper core and the honeycomb paper core with the bottom facial papers is coated with an inorganic cellulose coating layer; the antishock fiber layer I and the antishock fiber layer II are formed by placing a nanoparticle suspension into multiple layers of fabrics and compositing. The composite paper board is light in mass, good in strength and good in shock resistance, and can be applied to buffer protection in the field of industrial and civil used board materials.

Description

Technical field [0001] The present invention involves a method of preparation of a plate, especially a light -quality, environmentally friendly composite board with a light quality, excellent pressure -resistant resistance characteristics, and good waterproof and insulation characteristics. Background technique [0002] The board is the most commonly used material, and it is very wide, such as in the fields of decorative boards, packaging boards, and architecture.In the field of packaging boards, due to the improvement of people's living standards and the great development of logistics, the demand for packaging has increased rapidly, and due to changes in the nature of the product, it also puts forward higher requirements for its outer packaging board.In addition to excellent mechanical properties, including strength, toughness, and elasticity, environmental protection is also proposed. Due to the selectivity of its structure, plastic boards can be matched with various high -perf...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B27/12B32B29/02B32B3/12B32B5/18B32B29/08B32B27/10
CPCB32B3/12B32B5/18B32B27/10B32B27/12B32B29/005B32B29/02B32B29/08B32B2250/05B32B2307/102B32B2307/304B32B2307/306B32B2307/558B32B2307/718B32B2307/73B32B2439/00
Inventor 陈一
Owner HUNAN UNIV OF TECH
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