Organopolysiloxane composition used for packaging light-emitting diode
A technology of light-emitting diodes and polysiloxanes, which is applied to electrical components, circuits, semiconductor devices, etc., can solve the problems of waste products, easy separation of packaging materials and shells, and unsatisfactory adhesion of polyphthalamide. Achieve cost reduction, excellent bonding effect, and improve the effect of low bonding strength
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0025] Preparation of epoxy-containing phenyl vinyl polysiloxane:
[0026] Under the catalysis of anion exchange resin D296R, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, γ-methacryloxypropyltrimethoxysilane and diphenylsilane The diol was condensed at 70°C for 8 hours, then reduced to 100°C / 0.096MPa to remove low boilers, filtered to remove the anion exchange resin, and obtained epoxy-containing phenyl vinyl polysiloxane; 2-( 3,4-epoxycyclohexyl)ethyltrimethoxysilane, γ-methacryloxypropyltrimethoxysilane and diphenylsilanediol are represented by a, b and c in sequence, and the The molar ratio of a:b:c=3:0.5:4, a+b=3.5.
Embodiment 2
[0028] Preparation of epoxy-containing phenyl vinyl polysiloxane:
[0029] Under the catalysis of anion exchange resin D296R, 2-(3,4-epoxycyclohexyl)ethyltriethoxysilane, acryloyloxypropyltrimethoxysilane and diphenylsilanediol were 50°C, condensation reaction for 12 hours, then remove low boilers under reduced pressure at 100°C / 0.096MPa, filter to remove anion exchange resin, and obtain epoxy-containing phenyl vinyl polysiloxane; 2-(3,4 -Epoxycyclohexyl)ethyltriethoxysilane, acryloxypropyltrimethoxysilane, and diphenylsilanediol are represented by a, b, and c in turn, and the a:b:c The molar ratio of =2:2:4, a+b=4.
Embodiment 3
[0031] Preparation of epoxy-containing phenyl vinyl polysiloxane:
[0032] Under the catalysis of anion exchange resin D296R, 3-(2,3-glycidoxy)propyltriethoxysilane, methacryloxypropyltriethoxysilane and diphenylsilanediol Condensation reaction at 25°C for 15 hours, then remove low boilers under reduced pressure at 100°C / 0.096MPa, remove anion exchange resin by filtration, and obtain epoxy-containing phenyl vinyl polysiloxane; 3-(2, 3-glycidoxy)propyltriethoxysilane, methacryloxypropyltriethoxysilane and diphenylsilanediol are represented by a, b and c successively, and the a:b: The molar ratio of c=0.5:3:4, a+b=3.5.
PUM
Property | Measurement | Unit |
---|---|---|
refractive index | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com