Airtight packaging method of non-refrigeration infrared focal plane detector
A focal plane detector and uncooled infrared technology, which is applied in radiation control devices and other directions, can solve the problem that the price of uncooled infrared detectors cannot be accepted by the market, and achieve the goals of improving reliability, reducing costs, and reducing manufacturing costs Effect
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Embodiment 1
[0024] In the non-made infrared cold infrared focal plane detector prepared in this example, the photoelectric sensor 5 is made of barium strontium titanate (BST) ceramic material, and is connected by the common electrode 9; the readout circuit 6 is matched with the photoelectric sensor 5, and the tube The shell 7 is a conventional ceramic shell, and the window 8 is made of germanium.
[0025] The airtight packaging method of the uncooled infrared focal plane detector goes through the following steps:
[0026] In the first step, the readout circuit 6 and the photoelectric sensor 5 are flip-chip interconnected and packed together into the package 7; the surface of the window 8 for bonding with the package 7 is coated with epoxy resin;
[0027] In the second step, the shell 7 and the window 8 coated with epoxy resin are placed in the conventional glove box 11, and the glove box 11 is connected with the vacuum pump pipeline 12 connected with the vacuum pump. Vacuumize to 100mTor...
Embodiment 2
[0031] The airtight packaging method of the uncooled infrared focal plane detector goes through the following steps:
[0032] In the first step, the readout circuit 6 and the photoelectric sensor 5 are flip-chip interconnected and packed into the casing 7 together; the surface of the window 8 for bonding with the casing 7 is coated with silica gel;
[0033] In the second step, the shell 7 and the window plate 8 coated with silica gel are placed in the conventional glove box 11, and the glove box 11 is evacuated by the vacuum pump pipeline 12 connected with the vacuum pump. to 90mTorr, and then filled with dry argon through the inert gas pipeline 13, repeated vacuuming and filling with dry argon three times, until the environment in the glove box 11 was replaced with argon-based environment;
[0034] The third step is to heat the readout circuit 6, the photoelectric sensor 5, the shell 7 and the window 8 at 50° C. for 30 minutes in an argon-based environment to remove the reado...
Embodiment 3
[0037] The airtight packaging method of the uncooled infrared focal plane detector goes through the following steps:
[0038] In the first step, the readout circuit 6 and the photoelectric sensor 5 are flip-chip interconnected and packed together into the casing 7; the surface of the window 8 for bonding with the casing 7 is coated with instant adhesive;
[0039] In the second step, the shell 7 and the window 8 coated with instant adhesive are placed in the conventional glove box 11, and the glove box 11 is connected with the vacuum pump pipeline 12 connected with the vacuum pump. Vacuumize to 110mTorr, then fill dry xenon gas through the inert gas pipeline 13, repeat vacuuming and filling dry xenon gas three times, until the environment in the glove box 11 is replaced by xenon-based environment;
[0040] The third step is to heat the readout circuit 6, photoelectric sensor 5, tube shell 7 and window 8 at 100°C for 30 minutes in an environment dominated by xenon to remove the ...
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