Preparation method for low-temperature copper aluminum solder and low-temperature copper aluminum solder

A brazing filler metal, copper-aluminum technology, applied in the preparation of low-temperature copper-aluminum brazing filler metal, in the field of low-temperature copper-aluminum brazing filler metal, can solve the problems of easy fracture, brittle cracking, and insufficient strength of welding results, and achieve the effect of not being brittle.

Inactive Publication Date: 2015-11-25
YANTAI TIBRIGHT WELDING MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the welding result strength of zinc-aluminum solder is not enough in some applications, and aluminum-silicon-copper solder can make up for the welding quality of zinc-aluminum solder in many occasions in use, but due to the addition of copper, aluminum -The crystal structure of silicon-copper solder has changed, resulting in a brittle crystal structure, which is very prone to fracture and brittle cracking during processing

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0019] A preparation method of low-temperature copper-aluminum solder, comprising the following steps;

[0020] (1) Alloy ingot 1 composed of Al, Si and Cu and alloy ingot 2 composed of Al and Si are respectively added to the vacuum melting furnace for melting, and then respectively made into alloy 1 powder with a particle size of 200-80 mesh in the gas atomization equipment And alloy two powder; its oxygen content is controlled below 500ppm during the powder preparation process.

[0021] (2) Determine the proportion of alloy one powder and alloy two powder according to the Cu content required by the final solder product, add the medium temperature non-corrosion aluminum flux powder after the two powders are mixed, and then ball mill in a ball mill in a protective atmosphere for 0.5 to After 4 hours, it is finally formed into copper-aluminum solder under the extrusion of a 300-ton press. The extrusion molding process is carried out under the protection of carbon dioxide at 200...

Embodiment 1

[0025] A method for preparing low-temperature copper-aluminum solder, comprising the following steps;

[0026] (1) 40kg of alloy ingot one containing Al66%, Si9%, Cu25% and 60kg of alloy ingot two containing Al88% and Si12% are respectively added to the vacuum melting furnace for melting, and then placed in the gas atomization equipment successively to obtain two kinds 200-80 powder, namely alloy one powder (containing Al66%, Si9%, Cu25%), alloy two powder (containing Al88%, Si12%). The oxygen content is controlled below 500ppm during the powder preparation process.

[0027] (2) After mixing the powder of composition 1 and powder of composition 2, add 10 kg of medium-temperature non-corrosion aluminum flux powder. Add the mixed powder into a ball mill and ball mill for 2 hours in a CO2 protective atmosphere. Then the powder is taken out and extruded by a 300-ton press to form copper-aluminum solder. The extrusion molding process is carried out under the protection of CO2 at ...

Embodiment 2

[0032] A method for preparing low-temperature copper-aluminum solder, comprising the following steps;

[0033] (1) Add 50kg of alloy ingot one containing Al80%, Si10%, Cu10% and alloy ingot two 50kg containing Al70% and Si30% to the vacuum melting furnace for melting, and then make two kinds of ingots through gas atomization equipment 200-80 powder, namely alloy one powder (containing Al80%, Si10%, Cu10%), alloy two powder (containing Al70%, Si30%). The oxygen content is controlled below 500ppm during the powder preparation process.

[0034] (2) Mix the powder of composition 1 and the powder of composition 2 according to the ratio, and then add 10 kg of medium-temperature non-corrosion aluminum flux powder. Put the mixed powder into a ball mill and ball mill for 0.5 hour in a CO2 protective atmosphere. Then the powder is taken out and extruded by a 300-ton press to form copper-aluminum solder. 2 under protection.

[0035] The low-temperature copper-aluminum brazing filler ...

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Abstract

The invention provides a preparation method for low-temperature copper aluminum solder. The preparation method for the low-temperature copper aluminum solder is characterized by comprising the following steps: (1), respectively adding a composition I containing Al, Si and Cu and a composition II containing Al and Si to a vacuum melting furnace and an atomizing unit to prepare 20-80 powders, wherein the oxygen content is controlled below 500 ppm in a power preparing process; (2), determining the proportion content of the powder composition I and the power composition II according to a required Cu content, after mixing the two powder compositions, adding medium-temperature non-corrosion aluminum solder powders, and ball milling for 0.5-4 hours in a ball milling machine in protective atmosphere (CO2 and N2); extruding at 200-350 DEG C in the protective atmosphere of CO2 or N2 by a press machine of 300 tons to form the copper aluminum solder.

Description

technical field [0001] The invention relates to a preparation method of brazing filler metal, in particular to a preparation method of low-temperature copper-aluminum brazing filler metal and the low-temperature copper-aluminum brazing filler metal prepared by the method. Background technique [0002] Brazing material is a filler added in the gap or beside the gap in order to realize the combination of two materials or parts during the brazing process. The melting point of the solder must be lower than the melting point of the material being welded. It is suitable for the welding of precision, complex, multi-collar joints and dissimilar materials. The solder is divided into soft solder (solder with a melting point lower than 450°C) and hard solder (solder with a melting point higher than 450°C) according to the melting point. According to the composition of the solder, the solder includes tin-based, lead-based, zinc-based and other solders. Brazing materials include alumi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/28B23K35/40
Inventor 孙韶
Owner YANTAI TIBRIGHT WELDING MATERIALS CO LTD
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