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Copper aluminum alloy crystal oscillator chip coating process

A technology of copper aluminum alloy and crystal oscillator, which is applied in metal material coating process, sputtering plating, ion implantation plating, etc., can solve the problem of difficult control of composition ratio, copper and aluminum alloy performance not meeting requirements, and quartz sheet The content ratio cannot reach the predetermined value, etc., to achieve the effect of small impedance and firm combination

Inactive Publication Date: 2015-11-25
ZHONGSHAN TAIWEI ELECTRONICS CO LTD
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  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It is difficult to control the composition ratio of copper and aluminum evaporated in the above evaporation process, so the content ratio of copper and aluminum alloy on the quartz sheet often cannot reach the predetermined value, resulting in the performance of copper and aluminum alloy not meeting the required requirements

Method used

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  • Copper aluminum alloy crystal oscillator chip coating process

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Embodiment Construction

[0020] Reference figure 1 , The present invention discloses a copper-aluminum alloy crystal oscillator film coating process, including the following steps:

[0021] Step 1: Prepare aluminum target, copper target and quartz plate to be coated. In this process, both aluminum target and copper target must be made of pure aluminum or pure copper. Mixed metals cannot be used as targets.

[0022] Step two, place the aluminum target, copper target and quartz plate in the magnetron sputtering coating equipment. The coating working area of ​​the magnetron sputtering coating equipment is filled with high-purity argon gas, and the magnetron sputtering The coating equipment includes an ion emission device for emitting high-energy particles and a conveying device for moving the quartz plate. The magnetron sputtering coating equipment is an outsourcing device, and its structure is not detailed here, but both sides of the quartz plate It is equipped with an ion emission device, an aluminum targe...

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Abstract

The invention discloses an alloy coating process of a copper aluminum alloy crystal oscillator chip; a copper aluminum alloy film formed on a quartz plate through the process is firmly combined with the quartz plate, and the copper and aluminum component ratio in the copper aluminum alloy film can be precisely controlled, so that all performances of the finally finished copper aluminum alloy crystal oscillator chip can achieve needed settings on the basis of satisfying basic use requirements; and the copper aluminum alloy crystal oscillator chip has needed cooling capacity, electrical conductivity, lower impedance and hardness.

Description

Technical field [0001] The invention relates to a coating process, in particular to an alloy coating process of a copper-aluminum alloy crystal oscillator sheet. Background technique [0002] The metal conductive film layer is plated on the quartz wafer. The materials used as the metal conductive film layer are mainly gold, silver, aluminum and copper. The crystal oscillator using aluminum as the conductive layer has the best anti-stress effect, but aluminum is too material. It is soft, easy to scratch and oxidize, and compared with gold, silver and copper, aluminum has higher impedance, and its electrical and thermal conductivity are lower. [0003] The use of copper and aluminum alloy not only improves the anti-stress effect of the crystal oscillator, but also overcomes the disadvantages of large impedance, low electrical conductivity and thermal conductivity in the aluminum crystal oscillator. [0004] The traditional copper-aluminum alloy coating process is to place copper and a...

Claims

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Application Information

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IPC IPC(8): C23C14/18C23C14/35
CPCC23C14/18C23C14/35
Inventor 肖共和陈愿勤
Owner ZHONGSHAN TAIWEI ELECTRONICS CO LTD