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High-temperature-resistant packaging paper

A packaging paper, high temperature resistant technology, applied in paper, textile and papermaking, inorganic compound addition, etc., can solve the problem of low melting point, and achieve the effect of improving flame retardant performance, avoiding felling and protecting the environment

Inactive Publication Date: 2015-11-25
HEFEI LONGFA PACKING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, LDPE has a low melting point, and it will soften at around 80°C to 90°C, thereby degrading and producing harmful substances.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] A high-temperature-resistant packaging paper, comprising the following raw materials by weight: 22% bamboo, 21% wheat straw, 21% rice straw, 16% banana stalk, 10% basalt fiber, polymetaphenylene isophthalamide fiber 5 %, Polyphenylsulfonamide fiber 5%.

[0019] A method for preparing high-temperature-resistant packaging paper includes the following steps:

[0020] (1) Crush bamboo, wheat straw, rice straw and banana stalks, add water to make the ratio of scraps to moisture 1:3, and the temperature is 28°C to obtain plant slurry;

[0021] (2) Inject white-rot fungi into the plant slurry, the inoculation amount is 6% of the slurry weight, and carry out biological delignification for 15 days;

[0022] (3) After the slurry of 2) adopts intermittent displacement cooking, adjust the solid-liquid ratio of the slurry to 1:5, add hydrogen peroxide to 1% of the slurry weight, and delignify with hydrogen peroxide for 10 hours;

[0023] (4) Mix the slurry of 3) with basalt fiber, polymetaph...

Embodiment 2

[0027] A high-temperature-resistant packaging paper, comprising the following parts by weight of raw materials: 20% bamboo, 21% wheat straw, 21% rice straw, 15% banana stalk, 12% basalt fiber, polymetaphenylene isophthalamide fiber 6 %, Polyphenylsulfonamide fiber 5%.

[0028] A method for preparing high-temperature-resistant packaging paper includes the following steps:

[0029] (1) Crush bamboo, wheat straw, rice straw and banana stalks, add water to make the ratio of scraps to water 1:3.3, and the temperature is 29°C to obtain plant slurry;

[0030] (2) Inject white rot fungi into the plant slurry, the inoculation amount is 7% of the slurry weight, and carry out biological delignification for 16 days;

[0031] (3) After the slurry of 2) adopts intermittent displacement cooking, adjust the solid-liquid ratio of the slurry to 1:6, the addition amount of hydrogen peroxide is 1.5% of the slurry weight, and use hydrogen peroxide to delignify for 11 hours;

[0032] (4) Mix the slurry of 3...

Embodiment 3

[0036] A high-temperature-resistant packaging paper, including the following raw materials by weight: 21% bamboo, 21% wheat straw, 20% rice straw, 15% banana stalk, 11% basalt fiber, and polymetaphenylene isophthalamide fiber 6 %, polyphenylsulfonamide fiber 6%.

[0037] A method for preparing high-temperature-resistant packaging paper includes the following steps:

[0038] (1) Crush bamboo, wheat straw, rice straw and banana stalks, add water to make the ratio of scraps to moisture 1:3.5, and the temperature is 30°C to obtain plant slurry;

[0039] (2) Inject white-rot fungi into the plant slurry, the inoculation amount is 10% of the slurry weight, and carry out biological delignification for 18 days;

[0040] (3) After the slurry of 2) is cooked by intermittent displacement, the solid-liquid ratio of the slurry is adjusted to 1:7, the addition amount of hydrogen peroxide is 2% of the slurry weight, and the hydrogen peroxide is used for delignification for 12 hours;

[0041] (4) Mix t...

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PUM

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Abstract

The invention discloses high-temperature-resistant packaging paper. The preparing process includes the steps of preparing pulp, forming the packaging paper and coating the packaging paper. The high-temperature-resistant packaging paper is wide in application range, the outmost layer of the packaging paper is coated with a heat insulation agent, and therefore external heat entering a package is reduced; bamboo, wheat straw, rice straw and banana stems are added to avoid tree felling, protect the environment and maintain ecological balance; high-temperature-resistant fibers are added, so that the packaging paper does not deform in a high-temperature environment; as an environment-friendly fire retardant is added into the pulp, the flame-retardant property of the package is improved to protect a packaged object; in the delignification process, white rot fungi are used first for pretreating the raw materials, the time for delignification with hydrogen peroxide is shortened, the usage amount of the hydrogen peroxide for delignification is reduced, the hydrogen peroxide can disinfect and bleach the packaging paper, many things are achieved at one stroke, and cost is saved; the white rot fungi and the hydrogen peroxide are used for delignification, are safe, nontoxic, environmentally friendly and will not pollute the environment.

Description

Technical field [0001] The invention mainly relates to a packaging paper, in particular to a high-temperature resistant packaging paper. Background technique [0002] Packaging has two major functions: one is to protect products from damage and deterioration during manufacturing, transportation, storage, and sales; the other is to decorate, beautify, publicize and add value to products, and also beautify people’s lives and satisfy The increasing material and cultural needs of the broad masses of consumers have promoted and stimulated consumption. As an important packaging material, packaging paper has been widely used in product packaging in various industries. It includes box board and corrugated base paper, white cardboard and white cardboard, beverage flexible packaging paper, and special packaging paper. [0003] Generally used for waterproof and leak-proof packaging paper and various moisture-proof, waterproof and oil-proof papers are PE (polyethylene) coated paper, which use...

Claims

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Application Information

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IPC IPC(8): D21H13/38D21C5/00D21C3/02D21H17/64D21H21/34
Inventor 林悦敏
Owner HEFEI LONGFA PACKING CO LTD
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