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Switch contact with high current resistance and preparation method thereof

A switch contact and high current technology, applied in electric switches, contact materials, circuits, etc., can solve problems such as insufficient arc resistance of nickel and easy oxidation of molybdenum

Active Publication Date: 2018-03-27
HUIZHOU TONGFABAO MICRO CONTROL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

This patent uses pure molybdenum plus nickel plating layer, molybdenum is easy to oxidize, and the arc resistance of nickel is not high enough

Method used

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  • Switch contact with high current resistance and preparation method thereof
  • Switch contact with high current resistance and preparation method thereof

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Embodiment 1

[0040] Such as figure 1 , figure 2 The high-current-resistant switch contacts shown are small cylindrical grains, prismatic grains or elliptical cylindrical grains with a multi-layered layered structure. The first layer is a 2.0mm thick rubber layer 1, and the second layer is 0.1mm thick. The metal flake layer, as well as the third layer and the uppermost layer; the third layer is a transition metal element (nickel) alloy coating 3 with a thickness of 20 μm; the uppermost layer is a tungsten alloy coating 5 with a thickness of 5 μm, and the tungsten alloy coating 5 contains a weight ratio It is 75-90% metal tungsten element, containing 10-15% by weight of the above-mentioned transition metal elements, and 5-10% cobalt element in the tungsten alloy coating; the coating used is formed by electroless plating.

[0041] There is also a low tungsten alloy coating 4 with a thickness of 10 μm between the third layer and the uppermost layer. The low tungsten alloy coating 4 contains ...

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Abstract

The invention discloses a high-current-resistant switch contact, which has a multi-layer structure: the first layer is a rubber layer, the second layer is a metal sheet layer, the third layer is a transition metal coating, and the uppermost layer is a tungsten alloy coating. There may be a low tungsten alloy coating between the third layer and the uppermost layer, and the coating is formed by electroless plating. The tungsten alloy coating contains 75-90% by weight of tungsten elements, 10-15% by weight of transition metal elements, and a small amount of cobalt elements, and the low-tungsten alloy coating contains 50-75% by weight of metal tungsten element, a transition metal element with a weight ratio of 15-25%, and the tungsten alloy is preferably a tungsten-molybdenum alloy. In the preparation method of the present invention, the temperature of electroless plating used for the tungsten alloy coating is 65-75°C, and the time can be 50-70 minutes. The plating solution contains 55-100g / L of soluble tungsten compound, 10-50g / L of Soluble nickel compound, 5-30g / L soluble cobalt compound. The invention has good electric arc ablation resistance, low cost and good metallic luster.

Description

technical field [0001] The present invention relates to a component and a preparation method for a switch and a circuit contacting each other in the electric power or electronic industry. Background technique [0002] In traditional electrical or electronic equipment, the usual structure of the contact parts (contacts) used with ordinary switch panels or buttons is: a metal surface layer (such as a copper or nickel sheet) and a rubber bottom layer are compounded, and then A layer of gold or silver is plated on the surface of the metal surface layer to reduce resistance and increase conductivity. [0003] Tungsten is a rare metal with a high melting point, which can increase the high-temperature hardness of steel. It belongs to the sixth period (the second longest period) of the VIB group in the periodic table of elements. Tungsten is a silvery-white metal that looks like steel. Tungsten has a high melting point, low vapor pressure, and low evaporation rate. The chemical p...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01H1/04H01H11/04
Inventor 徐跃
Owner HUIZHOU TONGFABAO MICRO CONTROL TECH CO LTD