Transition-liquid-phase-assisted solid-phase connection method

A solid-phase connection and transition fluid technology, applied in welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problems of surface flatness and roughness of the connection interface, which affect the performance of joints, and improve high-temperature performance and reliability. , Improve welding efficiency, simplify the effect of surface cleaning process

Inactive Publication Date: 2015-12-02
NANCHANG HANGKONG UNIVERSITY
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Problems solved by technology

However, because the material is in the solid phase during the connection process, it is more demanding on the flatness and roughness of th

Method used

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Embodiment Construction

[0022] The present invention works and implements like this, as Figure 1-4 As shown, a transitional liquid-phase assisted solid-phase joining method simply grinds the joint surfaces of the materials to be welded 1 and the materials to be welded 5, and adds an intermediate layer 3 containing demelting elements between the materials to be welded 1 and 5, and assembles into a sandwich structure and placed on the lower support plate 4 of the vacuum diffusion welding furnace. Heating to between the melting point of the intermediate layer and the melting point of the material to be welded, through the interdiffusion between the demelting element and the material to be welded, the surface layer of the part to be connected is partially liquefied to form a liquefied phase 6, and then passes through the upper pressure head 2 to be welded 1 and 5 apply a certain forging pressure to extrude the liquid phase 7 to remove the physical and chemical uneven layer on the surface, and under the ...

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Abstract

The invention discloses a transition-liquid-phase-assisted solid-phase connection method. The method includes the steps that a middle layer material for transition liquid phase diffusion welding is placed at an interface to be connected, a transient liquid phase is formed on the surface to be welded through diffusion of melting point depressant elements in the middle material, forging force is applied, a liquefied phase on the surface of the material to be welded is extruded out of a joint region, a joint interface oxidation film of the material to be welded and a machining hardening layer are cleaned, and the requirement of a solid phase diffusion welding interface is met; after the liquid phase is extruded, certain pressure is kept, diffusion is further conducted, and a solid phase connection joint is formed. The transition-liquid-phase-assisted solid-phase connection method has the advantages that the oxidation film layer on the surface of the material to be welded and the machining hardening layer can be effectively removed through the liquid phase in the joint region, and the highly-required cleaning process of the surface to be welded before solid phase connection is conducted is avoided; meanwhile, the diffusion time for solid phase connection is shortened by removing the uneven layers on the surface of the joint, and welding efficiency is improved.

Description

technical field [0001] The invention relates to a transitional liquid-phase assisted solid-phase connection technology, which belongs to the mixed technology of instantaneous liquid-phase connection and diffusion welding; it is suitable for the high-efficiency connection of single crystal materials, especially for the connection of high-temperature structural materials such as aeroengine turbine blades. Background technique [0002] For new materials such as intermetallic compounds, composite materials, amorphous materials and single crystal materials, it is difficult to achieve reliable connection by traditional welding methods. At home and abroad, brazing, transient liquid phase diffusion welding (TLP), solid phase diffusion welding and other methods are mainly used. [0003] Brazing is to use a metal material with a lower melting point than the base metal as the solder, heat the weldment and the solder to a temperature higher than the melting point of the solder and lower...

Claims

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Application Information

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IPC IPC(8): B23K1/008B23K1/20
CPCB23K1/008B23K1/20
Inventor 黄永德曾志强仵艳影陈玉华何鹏
Owner NANCHANG HANGKONG UNIVERSITY
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