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Method for preparing copper powder with silver-plated surface

A technology of silver-plated copper powder and copper powder, which is applied in the direction of coating, etc., can solve the problems of being easily oxidized to cuprous oxide, loss of physical and chemical properties, high chemical activity, etc., and achieves high-efficiency reducibility, low price, and simple preparation process Effect

Inactive Publication Date: 2015-12-09
陈键
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  • Abstract
  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the large specific surface area and high chemical activity of ultra-fine copper powder, it is easily oxidized into cuprous oxide in the air, so that the original physical and chemical properties are lost or even disappear.

Method used

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Embodiment Construction

[0017] A kind of method for preparing surface silver-plated copper powder of the present invention, comprises the steps:

[0018] (1) Under normal temperature and pressure or under hydrothermal conditions, the oxidation-reduction reaction of soluble copper salt and reducing agent occurs in the liquid phase, and Cu 2+ Reduced to Cu atoms to make the required copper powder;

[0019] (2) Take AgNO 3 Add ethylenediaminetetraacetic acid to the solution, react at constant temperature, stir and add the copper powder prepared in step (1) to make Cu and Ag + A replacement reaction occurs, and the generated Ag precipitates on the surface of the copper powder. After the reaction lasts for 20 minutes, the silver-plated copper powder is obtained;

[0020] (3) Wash the silver-plated copper powder obtained in step (2) with distilled water for 2-5 times, and dry it in a vacuum oven to obtain the required silver-plated copper powder, and complete the silver-plating on the surface of the copp...

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Abstract

The invention discloses a method for preparing copper powder with a silver-plated surface and belongs to the field of processes of plating silver on the surface of copper powder. The method for preparing the copper powder with the silver-plated surface is characterized by comprising the following steps: reducing Cu<2+> to Cu atoms by redox reaction between a soluble copper salt and a reducing agent in a liquid phase to prepare needed copper powder; adding an AgNO3 solution into ethylenediamine tetraacetic acid, stirring, adding the copper powder, and performing replacement reaction between Cu and Ag<+> to obtain Ag which is precipitated on the surface of the copper powder; and washing with distilled water, and then baking to obtain the copper powder with the silver-plated surface. The silver plating treatment on the surface of the copper powder can be finished by improving an existing copper powder preparing process, and the copper powder with the silver-plated surface is prepared; and under a condition that excellent characters of the copper powder are kept, the oxidation resistance of the copper powder is effectively improved, and the application range of the copper powder is enlarged. The method for preparing the copper powder with the silver-plated surface is simple in preparation process, easy to operate and suitable for popularization and application.

Description

technical field [0001] The invention belongs to the technical field of silver plating on the surface of copper powder, and in particular relates to a method for preparing copper powder with silver plating on the surface. Background technique [0002] In recent years, ultrafine copper powder has high surface activity due to its small size and large specific surface area, and its research and application in the field of catalysis have been deepening. As a catalyst, ultrafine copper powder can improve the reaction efficiency, control the reaction temperature, optimize the reaction pathway, and even make the reaction that could not be carried out originally possible. Ultrafine copper powder can also be used to improve lubricants. As an additive, it is widely used in various lubricating oils. It is suspended and dispersed in lubricating oils to form a stable suspension and adsorbed on the surface of the instrument. A protective layer is formed, which reduces the friction coeff...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F9/24B22F1/02
Inventor 陈键
Owner 陈键
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