Method for preparing polyurethane hot melt adhesive capable of achieving quick positioning

A polyurethane hot melt adhesive, fast technology, applied in the direction of polyurea/polyurethane adhesive, adhesive, adhesive type, etc., can solve the problems of poor thermal shock resistance, inability to quickly locate, poor salt spray resistance, etc. , to achieve good drop resistance, improve initial bonding strength, and good thermal stability

Active Publication Date: 2015-12-09
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the disadvantages of low initial bond strength, inability to quickly locate, poor thermal shock resistance, poor salt spray resistance, poor aging resistance and low bonding strength existing in polyurethane hot melt adhesives in the prior art, the present invention provides a A polyurethane hot-melt

Method used

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  • Method for preparing polyurethane hot melt adhesive capable of achieving quick positioning
  • Method for preparing polyurethane hot melt adhesive capable of achieving quick positioning
  • Method for preparing polyurethane hot melt adhesive capable of achieving quick positioning

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] Example 1: 1) Add 5 parts of reactive plasticizer "Nikanol" resin and 8 parts of hydrogenated bisphenol A into the reactor, dehydrate at 110°C and -0.095MPa for 2h, cool down to 70°C, and add dilauric acid 0.01 parts of dibutyltin, 10 parts of German Bayer Desmodur N3300, stirred at 400 rpm, reacted at 70°C for 3 hours. Then add 20 parts of silane modifier Y9669 and react at 70° C. for 5 hours to obtain a silane-terminated modified prepolymer.

[0031] 2) Dehydrate 65 parts of polyester polyol XCP-3000H, 15 parts of polyether polyol PPG220, and 30 parts of acrylic resin DB256 at 120°C and -0.095MPa for 2 hours. After dehydration, add 4,4' di 35 parts of phenylmethane diisocyanate MDI-100, stirred at 700 rpm, reacted at 120°C for 1 hour, then added 5 parts of silane-terminated modified prepolymer prepared in step a, antioxidant 1.0 parts of 264 doses, 0.1 parts of dimorpholino diethyl ether (DMDEE), heated up to 110 ° C, vacuumed to below -0.095 MPa, removed air bubbles...

Embodiment 2

[0032] Example 2: 1) Add 20 parts of reactive plasticizer "Nikanol" resin and 1 part of hydrogenated bisphenol A into the reactor, dehydrate at 110°C and -0.095MPa for 2h, cool down to 70°C, add stannous octoate 0.05 parts, 45 parts of 2,4-toluene diisocyanate trimer, stirred at 700 rpm, and reacted at 80°C for 1 hour. Then add 30 parts of silane modifier A189 and react at 80° C. for 2 hours to obtain a silane-terminated modified prepolymer.

[0033] 2) Dehydrate 40 parts of polyester polyol POL-356T, 35 parts of polyether polyol PPG204, and 10 parts of acrylic resin DB66 at 120°C and -0.095MPa for 2 hours. After dehydration, add 4,4' di 9 parts of phenylmethane diisocyanate MDI-100, 3 parts of toluene diisocyanate TDI-100, stirred at 400 rpm, reacted at 100°C for 3 hours, and then added the silane-capped modification prepared in step a. 25 parts of permanent prepolymer, 0.02 part of antioxidant 1010, 0.001 part of triethylenediamine, heat up to 110°C, evacuate to below -0.09...

Embodiment 3

[0034] Example 3: 1) Add 13 parts of reactive plasticizer "Nikanol" resin and 4 parts of hydrogenated bisphenol A into the reactor, dehydrate at 110°C and -0.095MPa for 2h, cool down to 70°C, and add dilauric acid 0.04 parts of dibutyltin, 30 parts of triphenylmethane triisocyanate (TTI), stirred at 550 rpm, and reacted at 75°C for 2 hours. Then add 26 parts of silane modifier KH-550 and react at 75° C. for 3.5 hours to obtain a silane-terminated modified prepolymer.

[0035] 2) Dehydrate 33 parts of polyester polyol XCP-3000H, 20 parts of polyester polyol POL-356T, 25 parts of polyether polyol PPG210, and 20 parts of acrylic resin DB68 at 120°C and -0.095MPa for 2 hours After the dehydration is completed, add 14 parts of 4,4' diphenylmethane diisocyanate MDI and 5 parts of toluene diisocyanate TDI100, stir at a speed of 550 rpm, react at 110 °C for 2 hours, and then add this step a Prepared 15 parts of silane-terminated modified prepolymer, 0.05 part of antioxidant 1076, 0.0...

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PUM

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Abstract

The invention relates to a method for preparing polyurethane hot melt adhesive capable of achieving quick positioning. The preparing method includes the steps that 1, reactive tackifier and hydrogenated bisphenol A are added into a reaction still, dehydration is conducted for 2 hours at the temperature of 110 DEG C and the pressure intensity of -0.095 MPa, the mixture is cooled to 70 DEG C, a catalyst and polyisocyanate are added, stirring is conducted at the rotation speed of 400-700 r/min, a reaction is conducted for 1-3 hours at the temperature of 70 DEG C-80 DEG C, then a silane modifier is added, a reaction is conducted for 2-5 hours at the temperature of 70 DEG C-80 DEG C, and modified prepolymer at the sending end of silane is obtained; 2, dehydration is conducted on polyester polyol, polyether polyol and acrylic resin for 2 hours at the temperature of 120 DEG C and the pressure intensity of -0.095 MPa, after dehydration is conducted, the polyisocyanate is added, stirring is conducted at the rotation speed of 400-700 r/min, a reaction is conducted for 1-3 hours at the temperature of 100 DEG C-120 DEG C, then the prepared modified prepolymer at the sending end of the silane, antioxygen and the catalyst are added, the temperature is raised to 110 DEG C, vacuumizing is conducted till the pressure intensity is below -0.095 MPa, air bubble removing is conducted for 30 minutes, discharging and sealed packing are conducted, and the polyurethane hot melt adhesive capable of achieving quick positioning is obtained.

Description

technical field [0001] The invention relates to a preparation method of a polyurethane hot-melt adhesive capable of realizing rapid positioning, and belongs to the field of chemical adhesives. Background technique [0002] At present, in the assembly line link of touch screen packaging and manufacturing, there is an extremely urgent requirement for improving production efficiency. At present, traditional hot-melt adhesives are widely used for positioning and encapsulation. Due to the low initial adhesion of traditional hot melt adhesives, long positioning time, and low bonding strength, the initial positioning strength of 5 minutes is less than 0.1MPa, so the pressure must be maintained by a fixing device to meet the quality of the pressing. In order to ensure that the device can meet the requirements of packaging and bonding, the pressure holding time generally takes more than 2 hours, which seriously restricts the production efficiency of touch screen packaging manufactur...

Claims

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Application Information

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IPC IPC(8): C09J175/08C09J11/06C08G18/66C08G18/42C08G18/48C08G18/62C08G18/32C08G18/38C08G18/12
Inventor 姜贵琳王建斌陈田安解海华
Owner YANTAI DARBOND TECH
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