Unlock instant, AI-driven research and patent intelligence for your innovation.

Multi-layer circuit board riveting structure and its suspension line circuit and its realization method

A multi-layer circuit board, riveting structure technology, applied in the direction of multi-layer circuit manufacturing, printed circuit, printed circuit manufacturing, etc. Lightweight and compact effect

Active Publication Date: 2018-05-08
UNIV OF ELECTRONICS SCI & TECH OF CHINA
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a multilayer circuit board riveting structure and the suspension line circuit and its implementation method, which can realize the riveting processing of the multilayer circuit board and the riveting processing of the new medium integrated suspension line circuit, and solve the existing problems Laminate circuit lamination process costs are high, and traditional waveguide suspension line circuits need to process mechanical cavities and additional manual assembly, etc.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Multi-layer circuit board riveting structure and its suspension line circuit and its realization method
  • Multi-layer circuit board riveting structure and its suspension line circuit and its realization method
  • Multi-layer circuit board riveting structure and its suspension line circuit and its realization method

Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment

[0032] Example 1:

[0033] Such as figure 1 and figure 2 As shown, the multilayer circuit board riveting structure includes at least 2 layers of circuit boards that are laminated. The circuit board includes a dielectric substrate and metal layers disposed on the front and back of the dielectric substrate. After the circuit boards are laminated to form a multilayer circuit board body, in The multilayer circuit board body is provided with a rivet hole, and a rivet is inserted into the rivet hole, the upper end of the rivet is crimped with the upper surface of the multilayer circuit board body, and the lower end of the rivet is crimped with the lower surface of the multilayer circuit board body . Rivet holes can be metallized or non-metallized.

[0034] From the above structure, we can see that there is a zero-gap contact between adjacent circuit boards, so the present invention does not require traditional bonding material layers (such as prepregs) between adjacent circuit b...

Embodiment approach 1

[0038] Embodiment 1: For ordinary multilayer circuit board riveting, when the number of circuit boards is 3, the 3 circuit boards are respectively the first circuit board, the second circuit board, the third circuit board, the first circuit board, the second circuit board Partial areas of the circuit board and the third circuit board can be grooved but not hollowed out to form an air cavity, and the shape of each metal layer can be etched into any shape, which can be complete or incomplete; or One or several layers are completely free of metal layers. One or several layers of circuit boards can be provided with through holes, including metallized or non-metallized.

[0039] Further, in Implementation Mode 1, a device M is also included, and the device M includes an electronic component or an active device or a metamaterial or a dielectric material structure, and the device M can be placed in a groove of a circuit board, or on the outer surface of a multilayer circuit board . ...

Embodiment approach 2

[0040] Embodiment 2: For the riveting realization of the suspension line circuit, when the number of circuit boards is 3, the 3 circuit boards are respectively the first circuit board 11, the second circuit board 12, the third circuit board 13, and the second circuit board Partially hollow out and cut out the local area of ​​the first circuit board 11 to form a hollow cavity A5, the metal layer on the reverse side of the first circuit board 11 covers the top of the hollow cavity A5, and the metal layer on the front side of the third circuit board 13 covers the bottom of the hollow cavity A5. The cavity A5 and the metal layer on the front side of the third circuit board 13 and the metal layer on the back side of the first circuit board 11 form an air cavity structure.

[0041] Further, in Implementation Mode 2, the device M can also be placed in the circuit structure, and the device M includes: electronic components or active devices or metamaterials or dielectric material struc...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a multi-layer circuit board riveting structure, a suspended wire circuit formed by it, and a method for realizing the same. The multi-layer circuit board riveting structure includes at least two circuit boards that are stacked and arranged. The circuit board includes a dielectric substrate and a circuit board disposed on the dielectric substrate. For the metal layers on the front and back, the circuit boards are stacked to form a multilayer circuit board body. Rivet holes are opened in the multilayer circuit board body, and rivets are inserted into the rivet holes. For crimping, the lower end of the rivet is crimped to the lower surface of the multilayer circuit board body.

Description

technical field [0001] The present invention relates to multilayer circuit board technology and suspension line circuit technology. A suspension line circuit formed by a circuit board riveting structure, and a method for realizing the suspension line circuit. Background technique [0002] With the development of radio frequency circuits and microwave and millimeter circuits, multilayer circuit structures have been extensively studied and applied in order to achieve superior circuit performance such as miniaturization and high integration of circuit structures. The multi-layer circuit structure can realize the miniaturization of the circuit structure, high integration and three-dimensional integration of active and passive circuits. In the multilayer circuit structure, the dielectric integrated suspension line and the common multilayer circuit board in the form of strip line and groove line need to be pressed by a certain device. The commonly used method of lamination of mu...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H05K3/46
CPCH05K1/0298H05K3/4611
Inventor 马凯学王勇强闫宁宁李连岳牟首先
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com