Unlock instant, AI-driven research and patent intelligence for your innovation.

A conductive composite packaging material and preparation method thereof

A technology of packaging materials and conductive fillers, applied in the field of electronics, to achieve the effect of simple preparation method, strong shaping ability and good flexibility

Active Publication Date: 2018-10-02
TECHNICAL INST OF PHYSICS & CHEMISTRY - CHINESE ACAD OF SCI
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, traditional insulation processing methods require additional operational steps, and there is currently no method that integrates the fabrication and packaging of electronic materials in one step, so the development of a self-encapsulating electronic material is of great significance for simplifying its manufacturing process

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A conductive composite packaging material and preparation method thereof
  • A conductive composite packaging material and preparation method thereof
  • A conductive composite packaging material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] The conductive filler of the self-encapsulating conductive composite material is BiInSnZn alloy, and the polymer matrix is ​​184 silica gel. Metal Bismuth (Bi), Indium (In), Tin (Sn) and Zinc (Zn) are formulated into alloys according to the mass fraction ratio of 35%, 48.6%, 16% and 0.4%, and placed in a heating chamber at a temperature of 90°C Keep the molten state in the box for standby (the preparation method of the alloy is a prior art, see patent CN103432624 A). Next, prepare 184 silica gel, and the mass ratio of liquid A to liquid B is 10:1. After mixing and stirring liquid A and liquid B, mix the silica gel and the liquid conductive filler at a volume ratio of 1:1, put it in a heating box at 90°C and stir it with a glass rod for 10 minutes (stirring speed 60 rpm). No obvious and continuous liquid metal droplets can be seen. After the liquid metal is stirred with silica gel, the continuous phase is dispersed and wrapped by silica gel to form microspheres.

[004...

Embodiment 2

[0044] The raw materials are the same as in Example 1, the volume ratio of 184 silica gel and liquid alloy mixed is 8:2, the mixed conductive compound is injected into the mold to form a block sample with a thickness of 1 cm, and it is left standing at 25°C during the standing stage 60 hours. Other operations are the same as in Example 1. Because the curing speed is slow, the metal particles settle fully, the boundary between the two phases is clear, and no transition layer can be observed.

[0045] Since the upper surface of the self-encapsulated conductive composite material is insulated and the interior is conductive, and a module with a certain thickness has been formed, the components that need to be connected to the circuit can be directly inserted into the composite material for use. Since the obtained composite material is soft and elastic, the conductive composite material can play the role of a safe and effective connection seat, and is not limited by the shape of t...

Embodiment 3

[0047] The conductive filler of the self-encapsulating conductive composite is Bi 31.6 In 48.8 sn 19.6 The alloy (melting point is 59°C) polymer base is 184 silica gel. Mix 184 silica gel and conductive filler at a volume ratio of 3:7, place it in a heating box at 90°C and stir it magnetically for 10 minutes (stirring speed 200 rpm), at this time, no obvious and continuous liquid metal can be seen with the naked eye. Drops, after the liquid metal is stirred with silica gel, the continuous phase is broken up and wrapped by silica gel to form microspheres.

[0048] The mixed compound is drawn into a syringe, injected into a rectangular mold with a length of 5 cm, a width of 1 cm, and a height of 1 cm, and then left to stand at a temperature of 100°C for 30 minutes; Let cool and unmold. The formed composite material has good flexibility. Test the obtained solid composite material with a multimeter at room temperature, and find that the resistance between any two points on th...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle diameteraaaaaaaaaa
melting pointaaaaaaaaaa
diameteraaaaaaaaaa
Login to View More

Abstract

The present invention proposes a conductive composite packaging material, which is composed of a polymer base material and a conductive filler, the conductive filler is concentrated locally, and the volume ratio of the volume of the conductive filler to the polymer base material is 10-90:90-10. The base material is one of polyethylene, polypropylene, polysiloxane, epoxy resin, and phenolic resin, and the conductive filler is bismuth, indium, tin, cadmium, zinc, gallium, iron, nickel, and calcium. One or more alloys. The invention also proposes a preparation method of the composite packaging material. The injectable self-encapsulating polymer-based conductive composite material proposed by the present invention can avoid or reduce external interference on its conductive region by forming an insulating layer, and ensure the stability and effectiveness of the composite material; the preparation method of the composite material is simple and easy Realization, the traditional step-by-step manufacturing and integration process of conductors and insulators can be optimized and realized simultaneously in only one step, saving time and effort.

Description

technical field [0001] The invention belongs to the field of electronics, and in particular relates to a packaging material containing metal and a preparation method thereof. Background technique [0002] Conductive composites are usually composed of several materials with different conductive properties. In recent years, research hotspots on conductive composites tend to focus on polymer-based conductive composites. The conductive filler components in polymer-based conductive composites are generally fibers, particles and nanoparticles of carbon black, graphite, metals and their compounds, which are dispersed in polymer-based materials as fillers. Common polymer matrix Including polyolefins, resinous substances, etc. This polymer-based conductive composite material not only has the electrical characteristics of conductive components, but also has the characteristics of stretchable, deformable, flexible and plastic materials. Therefore, the combination of the two achieves ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C08L61/06C08L63/00C08L83/04C08L23/12C08L23/06C08K3/08C09K3/10H01L23/29
Inventor 衣丽婷刘静
Owner TECHNICAL INST OF PHYSICS & CHEMISTRY - CHINESE ACAD OF SCI
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com