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A kind of fast photocurable polyimide oligomer and its preparation method and application

A technology of polyimide and polyimide resin, which is applied in the field of fast photocurable polyimide oligomer and its preparation, can solve the problems of poor solubility of pre-imidized polyimide, etc. Fewer types, beneficial to industrial production of products, and easy to operate

Active Publication Date: 2018-02-27
LANZHOU INST OF CHEM PHYSICS CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The present invention adopts the method of maleic anhydride capping and phenolic hydroxyl-containing monomers, and introduces active double bonds into the two ends and side groups of the polyimide molecular chain, which not only keeps the pre-imidized polyimide in active dilution It has good solubility in agents such as cyclotrimethylolpropane formal acrylate, N-vinylpyrrolidone, etc., and realizes the controllable preparation of polyimide oligomer unsaturation and molecular weight, and solves the problem of pre-sublimation The problem of poor solubility of aminated polyimide

Method used

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  • A kind of fast photocurable polyimide oligomer and its preparation method and application
  • A kind of fast photocurable polyimide oligomer and its preparation method and application
  • A kind of fast photocurable polyimide oligomer and its preparation method and application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Structural formula of fast photocurable polyimide oligomer poly(FOPI-MA):

[0033]

[0034] Preparation of poly(FOPI-MA):

[0035] At 5°C, add 36.6g 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane and 40.0g 4,4'-diaminodiphenyl ether to 1500mL N-methyl-2-pyrrolidone , 77.5g 3,3',4,4'-diphenyl ether tetra-acid dianhydride and 9.8g maleic anhydride, stirred for 2 hours, then raised to 130°C for 4 hours, continued to heat to 200°C and refluxed for 2 hours, distilled After removing 500mL of solvent, continue to heat and reflux at 200°C for 12 hours, cool the reaction solution to room temperature, then add 105mg of triethylamine, 220mg of tetraethylammonium bromide and 1.5g of hydroquinone, stir well and then add 42.6g of formazan Glycidyl acrylate, heated to 100°C for 4 hours, cooled to room temperature, poured the reaction liquid into 2.0L of absolute ethanol to precipitate solids, filtered and washed once with 2L of distilled water, then washed with 1L of absolute e...

Embodiment 2

[0039] Structural formula of fast photocurable polyimide oligomer poly(FFPI-MA):

[0040]

[0041] Preparation of poly(FFPI-MA):

[0042] At 5°C, add 36.6g 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane and 40.0g 4,4'-diaminodiphenyl ether to 3000mL N-methyl-2-pyrrolidone , 111.0g 2,2'-bis(3,4-dicarboxyphenyl)hexafluoropropanecarboxylic dianhydride and 9.8g maleic anhydride, stirred for 2 hours, then raised to 150°C for 2 hours, continued heating to 210°C to reflux After 3 hours, after distilling off 1200mL of solvent, continue to heat and reflux at 210°C for 4 hours, cool the reaction solution to room temperature, then add 105mg of triethylamine, 220mg of tetraethylammonium bromide and 1.5g of hydroquinone, and stir well Then add 42.6g of glycidyl methacrylate, heat to 100°C and react for 4 hours. After cooling to room temperature, pour the reaction liquid into 4L of absolute ethanol to precipitate solid matter. After filtering, wash with 4L of distilled water and 2L o...

Embodiment 3

[0046] Structural formula of fast photocurable polyimide oligomer poly(SFPI-MA):

[0047]

[0048] Preparation of poly(SFPI-MA):

[0049] At 0°C, add 84.1g 3,3'-diamino-4,4'-dihydroxydiphenylsulfone, 116.9g 1,4-bis(4-aminophenoxy) to 5000mL N-methyl-2-pyrrolidone base) benzene, 266.5g 2,2'-bis(3,4-dicarboxyphenyl)hexafluoropropanecarboxylic dianhydride and 9.8g maleic anhydride, stirred for 4 hours, then raised to 150°C for 3 hours, and continued to heat to After reflux at 210°C for 4 hours, distill off 2000mL of solvent and continue to heat and reflux at 210°C for 4 hours, cool the reaction solution to room temperature, then add 160mg of triethylamine, 340mg of tetraethylammonium bromide and 2.0g of hydroquinone After stirring evenly, add 85.3g glycidyl methacrylate, heat to 100°C and react for 5 hours. After cooling to room temperature, pour the reaction liquid into 5L absolute ethanol to precipitate solids. After filtering, wash with 4L distilled water and 2L anhydrous ...

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Abstract

The invention discloses a polyimide oligomer capable of quick photocuring. The structural general formula of the oligomer is disclosed in the specification, wherein 1<=x<=25, and 0<=y<=25; R1 is selected from one of isopropylidene group and sulfinyl group; R2 and R3 are selected from one of ether oxy group, sulfinyl group, carbonyl group, hexafluoroisopropylidene group, bis(4-phenoxy)isopropylidene group, 1,4-p-diphenoxy group and 1,3-m-diphenoxy group; and R4 is selected from one of hydrogen and methyl group. The invention also discloses a preparation method and application of the oligomer. The method is simple, and has the advantages of accessible raw materials and lower cost. The preparation technique is compatible with universal technological equipment, and is beneficial to industrialization.

Description

technical field [0001] The invention belongs to the field of rapid photocurable resins, in particular to a rapid photocurable polyimide oligomer and its preparation method and application, which are mainly used in electrical insulation, microelectronic packaging and precision machinery that require rapid curing. It can also be used in the field of rapid prototyping manufacturing resins. Background technique [0002] Polyimide has excellent comprehensive properties, such as high heat resistance, good chemical stability, medium resistance and mechanical properties. Since 1964, after more than half a century of research and development, polyimide has developed into a variety of products including films, fibers, adhesives, composite materials, foam plastics, etc., which are widely used in aerospace, military, micro Electronics, liquid crystal, sharing film and other fields, it has been listed as one of the most promising engineering plastics in the 21st century. [0003] Polyi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C07D403/14C09D4/02C09D4/00
CPCC07D403/14C09D4/00
Inventor 王晓龙郭玉雄马正峰周峰
Owner LANZHOU INST OF CHEM PHYSICS CHINESE ACAD OF SCI
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