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Polyimide oligomer capable of quick photocuring and preparation method and application thereof

A polyimide, photocuring technology, applied in the direction of organic chemistry, coating, etc., can solve the problem of poor solubility of pre-imidized polyimide, and achieve the effect of less solvent types, easy operation and mild conditions

Active Publication Date: 2015-12-16
LANZHOU INST OF CHEM PHYSICS CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The present invention adopts the method of maleic anhydride capping and phenolic hydroxyl-containing monomers, and introduces active double bonds into the two ends and side groups of the polyimide molecular chain, which not only keeps the pre-imidized polyimide in active dilution It has good solubility in agents such as cyclotrimethylolpropane formal acrylate, N-vinylpyrrolidone, etc., and realizes the controllable preparation of polyimide oligomer unsaturation and molecular weight, and solves the problem of pre-sublimation The problem of poor solubility of aminated polyimide

Method used

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  • Polyimide oligomer capable of quick photocuring and preparation method and application thereof
  • Polyimide oligomer capable of quick photocuring and preparation method and application thereof
  • Polyimide oligomer capable of quick photocuring and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] Structural formula of fast photocurable polyimide oligomer poly(FOPI-MA):

[0032]

[0033] Preparation of poly(FOPI-MA):

[0034] At 5°C, 36.6g of 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane, 40.0g of 4,4'-diaminodiphenyl ether, 77.5g of 3 , 3',4,4'-Diphenyl ether tetra-acid dianhydride and 9.8g maleic anhydride, stirred for 2 hours, then heated to 130°C for 4 hours, continued to heat to 200°C and refluxed for 2 hours, distilled off 500mL of solvent Continue to heat and reflux at 200°C for 12 hours, cool the reaction solution to room temperature, then add 105mg triethylamine, 220mg tetraethylammonium bromide and 1.5g hydroquinone, stir well and add 42.6g glycidyl methacrylate Ester, heated to 100°C for 4 hours, cooled to room temperature, poured the reaction liquid into 2.0L absolute ethanol to precipitate solid matter, filtered and washed once with 2L distilled water, then washed once with 1L absolute ethanol, Vacuum drying at 45° C. yielded 148 g of polyim...

Embodiment 2

[0038] Structural formula of fast photocurable polyimide oligomer poly(FFPI-MA):

[0039]

[0040] Preparation of poly(FFPI-MA):

[0041] At 5°C, add 36.6g 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane, 40.0g 4,4'-diaminodiphenyl ether, 111.0g2 , 2'-bis(3,4-dicarboxyphenyl)hexafluoropropanecarboxylic dianhydride and 9.8g maleic anhydride, stirred for 2 hours, then raised to 150°C for 2 hours, continued heating to 210°C and refluxed for 3 hours, After distilling off 1200mL of solvent, continue to heat and reflux at 210°C for 4 hours, cool the reaction solution to room temperature, then add 105mg of triethylamine, 220mg of tetraethylammonium bromide and 1.5g of hydroquinone, stir well and then add 42.6g Glycidyl methacrylate, heated to 100°C for 4 hours, cooled to room temperature, poured the reaction liquid into 4L of absolute ethanol to precipitate solids, washed with 4L of distilled water and 2L of absolute ethanol for 2 times after filtration , and dried under vacuu...

Embodiment 3

[0045] Structural formula of fast photocurable polyimide oligomer poly(SFPI-MA):

[0046]

[0047] Preparation of poly(SFPI-MA):

[0048] At 0°C, add 84.1g of 3,3'-diamino-4,4'-dihydroxydiphenylsulfone and 116.9g of 1,4-bis(4-aminophenoxy)benzene to 5000mL of N-methyl-2-pyrrolidone , 266.5g of 2,2'-bis(3,4-dicarboxyphenyl)hexafluoropropanecarboxylic dianhydride and 9.8g of maleic anhydride, stirred for 4 hours, then raised to 150°C for 3 hours, and continued to heat to 210°C to reflux for 4 hours Hours later, after distilling off 2000mL of solvent, continue to heat and reflux at 210°C for 4 hours, cool the reaction solution to room temperature, then add 160mg of triethylamine, 340mg of tetraethylammonium bromide and 2.0g of hydroquinone, and stir evenly Add 85.3g of glycidyl methacrylate, heat to 100°C and react for 5 hours. After cooling to room temperature, pour the reaction liquid into 5L of absolute ethanol to precipitate solid matter. After filtering, wash with 4L of ...

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PUM

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Abstract

The invention discloses a polyimide oligomer capable of quick photocuring. The structural general formula of the oligomer is disclosed in the specification, wherein 1<=x<=25, and 0<=y<=25; R1 is selected from one of isopropylidene group and sulfinyl group; R2 and R3 are selected from one of ether oxy group, sulfinyl group, carbonyl group, hexafluoroisopropylidene group, bis(4-phenoxy)isopropylidene group, 1,4-p-diphenoxy group and 1,3-m-diphenoxy group; and R4 is selected from one of hydrogen and methyl group. The invention also discloses a preparation method and application of the oligomer. The method is simple, and has the advantages of accessible raw materials and lower cost. The preparation technique is compatible with universal technological equipment, and is beneficial to industrialization.

Description

technical field [0001] The invention belongs to the field of rapid photocurable resins, in particular to a rapid photocurable polyimide oligomer and its preparation method and application, which are mainly used in electrical insulation, microelectronic packaging and precision machinery that require rapid curing. It can also be used in the field of rapid prototyping manufacturing resins. Background technique [0002] Polyimide has excellent comprehensive properties, such as high heat resistance, good chemical stability, medium resistance and mechanical properties. Since 1964, after more than half a century of research and development, polyimide has developed into a variety of products including films, fibers, adhesives, composite materials, foam plastics, etc., which are widely used in aerospace, military, micro Electronics, liquid crystal, sharing film and other fields, it has been listed as one of the most promising engineering plastics in the 21st century. [0003] Polyi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C07D403/14C09D4/02C09D4/00
CPCC07D403/14C09D4/00
Inventor 王晓龙郭玉雄马正峰周峰
Owner LANZHOU INST OF CHEM PHYSICS CHINESE ACAD OF SCI
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