Phenolic foam heat insulation board of core-shell structure and preparing method thereof

A technology of foam insulation board and core-shell structure, applied in the field of phenolic foam insulation board and its preparation, can solve the problems of low toughness and easy breakage of phenolic foam, improve water absorption and comprehensive performance, reduce the possibility of fracture, and improve thermal conductivity. The effect of coefficient reduction

Active Publication Date: 2015-12-30
SHENYANG INSTITUTE OF CHEMICAL TECHNOLOGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The object of the present invention is to provide a phenolic foam insulation board with a core-shell structure and a

Method used

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  • Phenolic foam heat insulation board of core-shell structure and preparing method thereof
  • Phenolic foam heat insulation board of core-shell structure and preparing method thereof
  • Phenolic foam heat insulation board of core-shell structure and preparing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0035] Example 1

[0036] (1) Add phenol, paraformaldehyde, and sodium hydroxide into the reactor at a mass ratio of 65:30:1, add solid paraformaldehyde in batches at a water bath temperature of 60°C, control the addition for half an hour, and continue to react for half After hours, raise the temperature to 90°C and continue the reaction for 1.5 hours to obtain a phenolic resin. Take 100.0 parts of phenolic resin, 6.0 parts of surfactant, 15 parts of foaming agent n-pentane, 15 parts of curing agent, and 1 part of nucleating agent, mix and stir evenly for use.

[0037] (2) Take 100 parts of polyethylene adipate glycol (PEA2000), 10 parts of toluene diisocyanate (TDI-80), and 0.1 part of dibutyl tin dilaurate (DBTDL) into the reactor at 80°C React under vacuum for 1 hour to prepare polyurethane prepolymer. Take 100 parts of polyurethane prepolymer, 2 parts of foam stabilizer, and 12 parts of foaming agent, mix and stir evenly for later use.

[0038] (3) Reaction kettles A and C con...

Example Embodiment

[0039] Example 2

[0040] (1) Add phenol, paraformaldehyde, and sodium hydroxide into the reactor at a mass ratio of 65:35:1, add solid paraformaldehyde in batches at a water bath temperature of 60°C, control the addition for half an hour, and continue to react for half Hours, raise the temperature to 90℃, continue to react

[0041] It should take 1.5 hours to get phenolic resin. Take 100.0 parts of phenolic resin, 6.0 parts of surfactant, 15 parts of foaming agent n-pentane, 15 parts of curing agent, and 1 part of nucleating agent, mix and stir evenly for use.

[0042] (2) Take 100 parts of polyethylene adipate glycol (PEA2000), 10 parts of toluene diisocyanate (TDI-80), and 0.1 part of dibutyl tin dilaurate (DBTDL) into the reactor at 80°C React under vacuum for 1 hour to prepare polyurethane prepolymer. Take 100 parts of polyurethane prepolymer, 2 parts of foam stabilizer, and 12 parts of foaming agent, mix and stir evenly for later use.

[0043] (3) Same as the third step of Ex...

Example Embodiment

[0044] Example 3

[0045] (1) Add phenol, paraformaldehyde, and sodium hydroxide into the reaction kettle at a mass ratio of 65:40:1, add solid paraformaldehyde in batches at a water bath temperature of 60℃, control the addition for half an hour, and continue to react for half After hours, raise the temperature to 90°C and continue the reaction for 1.5 hours to obtain a phenolic resin. Take 100.0 parts of phenolic resin, 6.0 parts of surfactant, 15 parts of foaming agent n-pentane, 15 parts of curing agent, and 1 part of nucleating agent, mix and stir evenly for use.

[0046] (2) Take 100 parts of polyethylene adipate glycol (PEA2000), 10 parts of toluene diisocyanate (TDI-80), and 0.1 part of dibutyl tin dilaurate (DBTDL) into the reactor at 80°C React under vacuum for 1 hour to prepare polyurethane prepolymer. Take 100 parts of polyurethane prepolymer, 2 parts of foam stabilizer, and 12 parts of foaming agent, mix and stir evenly for later use.

[0047] (3) Same as the third ste...

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Abstract

The invention relates to a heat insulation board and a preparing method thereof, in particular to a phenolic foam heat insulation board of a core-shell structure and a preparing method thereof. Surface layers of the phenolic foam heat insulation board are made of phenolic foam, the core layer of the phenolic foam heat insulation board is made of polyurethane foam, a phenolic resin system accounts for 100 parts, and a polyurethane prepolymer system accounts for 20 parts by mass. The materials are foamed in a mold according to a preset synthetic process, solidified, cured and formed to obtain the phenolic aldehyde foam heat insulation board with good tenacity, and the defect that a phenolic foam board with certain tenacity is obtained through a traditional toughening method at the cost of fire resistance reduction is overcome. Phenolic resin is endowed with softness of the core layer polyurethane foam, the heat conductivity coefficient is further reduced, and the waterproof performance of the phenolic aldehyde foam board is improved. The phenolic aldehyde foam heat insulation board can be used as heat insulation and sound insulation materials.

Description

technical field [0001] The invention relates to a thermal insulation board and a preparation method thereof, in particular to a phenolic foamed thermal insulation board with a core-shell structure and a preparation method thereof. Background technique [0002] Phenolic resin has been mass-produced into products, and has been widely used in the fields of electrical engineering, aviation, construction and aerospace due to its advantages of good heat resistance, high mechanical strength, electrical insulation and high temperature resistance. [0003] Phenolic foam usually consists of resole phenolic resin, surfactant, foaming agent, mixing evenly and then adding curing agent, stirring evenly and then heating and foaming, the formed phenolic foam generally has high density, high brittleness, high water absorption, etc. Defects, so the phenolic resin used in phenolic foam foaming needs to be modified with flexible materials to solve some of the defects of phenolic foam. The brit...

Claims

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Application Information

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IPC IPC(8): C08L61/10C08L75/06C08L75/08C08K3/22C08K3/36C08G8/10C08G18/76C08G18/42C08G18/48C08J9/14
Inventor 葛铁军肖尚雄王佳陈瑞杰
Owner SHENYANG INSTITUTE OF CHEMICAL TECHNOLOGY
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