Antistatic flame-retardation circuit board

Abstract

A disclosed antistatic flame-retardation circuit board comprises a circuit board main body, a sealing layer arranged on the circuit board main body, and a protective layer arranged on the sealing layer; the sealing layer fixedly seals the side, carrying electronic components, of the circuit board main body; and the protective layer wraps the sealing layer. The side, possessing soldering tin, of the circuit board main body is provided with a heat radiation layer, and the heat radiation layer and the circuit board main body are in connection by employing a mutually-matched concealed, overlapped or plug-in way; the circuit board main body is provided with a plurality of through holes, one side of the heat radiation layer is provided with a groove, the groove is filled with a heat-conduction liquid, and the heat-conduction liquid is capable of freely flowing in the groove and the through holes; and the connection position of the heat radiation layer and the circuit board main body is sealed by using pouring silica gel. The circuit board possesses excellent antistatic, moistureproof and electrical-isolation performances, also possesses the characteristics of good flame retardation, heat radiation and the like.

Description

technical field [0001] The invention relates to a circuit board, in particular to an antistatic and flame retardant circuit board. Background technique [0002] Circuit boards are now used in all aspects of people's lives and are an indispensable and important part of electronic products. Therefore, the performance of circuit boards is very important to electronic products. During the use of the circuit board, it is easy to be damaged by static electricity, moisture and other factors, which seriously affects its service life. Nowadays, the common practice is to package the circuit board. Therefore, the choice of the packaging material is indirect. Performance, currently used packaging materials include epoxy resin, polymethyl methacrylate, glass, silicone and other high-transparency materials. Epoxy resin and silicone materials are used as the main packaging materials. The internal stress of epoxy resin is too large and yellowing , poor high and low temperature resistance, ...

AI Technical Summary

Problems solved by technology

During the use of the circuit board, it is easy to be damaged by static electricity, moisture and other factors, which seriously affects its service life. Nowadays, the common practice is to package the circuit board. Therefore, the choice of the packaging material is indirect. Performance, currently used packaging materials include epoxy resin, polymethyl methacrylate, glass, silicone and other high-transparency materials. Epoxy resin and silicone materials are used as the main packaging materials. The internal stress of epoxy resin is too large and yellowing , poor high and low temperature resistance, and poor aging resistance, while the current silicone materials have small internal stress, good high and low temperature resistance, no yellowing, and higher light transmittance than epoxy resin, but there is adhesion to the substrate Poor performance leads to failure of encapsulation, or decline in aging resistance performance, and due to backward production technology, the sealing performance of the circuit board after encapsulation is not stable, resulting in short service life of the circuit board, and once a short circuit occurs on the circuit board and causes a fire, ordinary organic Silicone sealant can burn itself, which intensifies the fire, especially when the circuit board containing silicone is used in the gas meter, the hidden danger is even greater; most of the existing circuit boards do not have a heat dissipation layer, especially the circuit board with a sealed structure. When the heat of a circuit board with a sealed structure is not discharged in time, it is easy to cause a failure or even a fire

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