Samarium-tin-copper alloy electroplating solution and electroplating method thereof
A copper alloy and electroplating solution technology, applied in the field of electroplating solution, can solve the problems of poor wear resistance and corrosion resistance of the coating, difficulty in obtaining a stable coating, poor stability, etc., and achieve strong corrosion resistance, good stability and Dispersion ability, combined with good effect
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Embodiment 1
[0021] Embodiment 1: the samarium-tin-copper alloy electroplating solution of the present embodiment comprises following components:
[0022]
[0023] Use above-mentioned samarium-tin-copper alloy electroplating solution electroplating method as follows:
[0024] Configure samarium-tin-copper alloy electroplating solution: dissolve citric acid, potassium vinylsulfonate and sodium pyrophosphate in deionized water to form a solution, add copper sulfate, tin sulfate and samarium oxide to the solution, stir and dissolve to prepare into a mixed solution, adding saccharin, sodium acetate and disodium edetate to the mixed solution to dissolve to obtain a samarium-tin-copper alloy electroplating solution; wherein, in the samarium-tin-copper alloy electroplating solution Copper sulfate 30g / L, tin sulfate 20g / L, samarium oxide 0.1g / L, potassium vinylsulfonate 2g / L, sodium pyrophosphate 10g / L, citric acid 6g / L, disodium edetate 10g / L L, saccharin 0.5g / L and sodium acetate 10g / L, pH i...
Embodiment 2
[0026] Embodiment 2: the samarium-tin-copper alloy electroplating solution of the present embodiment comprises following components:
[0027]
[0028] Use above-mentioned samarium-tin-copper alloy electroplating solution electroplating method as follows:
[0029] Configure samarium-tin-copper alloy electroplating solution: dissolve citric acid, potassium vinylsulfonate and sodium pyrophosphate in deionized water to form a solution, add copper sulfate, tin sulfate and samarium oxide to the solution, stir and dissolve to prepare into a mixed solution, adding saccharin, sodium acetate and disodium edetate to the mixed solution to dissolve to obtain a samarium-tin-copper alloy electroplating solution; wherein, in the samarium-tin-copper alloy electroplating solution Copper sulfate 36g / L, tin sulfate 22g / L, samarium oxide 0.1g / L, potassium vinylsulfonate 2g / L, sodium pyrophosphate 12g / L, citric acid 8g / L, disodium edetate 14g / L L, saccharin 0.8g / L and sodium acetate 12g / L, pH i...
Embodiment 3
[0031] Embodiment 3: the samarium-tin-copper alloy electroplating solution of the present embodiment comprises following components:
[0032]
[0033]
[0034] Use above-mentioned samarium-tin-copper alloy electroplating solution electroplating method as follows:
[0035] Configure samarium-tin-copper alloy electroplating solution: dissolve citric acid, potassium vinylsulfonate and sodium pyrophosphate in deionized water to form a solution, add copper sulfate, tin sulfate and samarium oxide to the solution, stir and dissolve to prepare into a mixed solution, adding saccharin, sodium acetate and disodium edetate to the mixed solution to dissolve to obtain a samarium-tin-copper alloy electroplating solution; wherein, in the samarium-tin-copper alloy electroplating solution Copper sulfate 38g / L, tin sulfate 25g / L, samarium oxide 0.2g / L, potassium vinylsulfonate 3g / L, sodium pyrophosphate 14g / L, citric acid 10g / L, edetate disodium 14g / L L, saccharin 1.2g / L and sodium acetat...
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