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Reworkable epoxy resin flux and preparing method thereof

A technology of epoxy resin and solid epoxy resin, used in welding equipment, welding medium, manufacturing tools, etc., can solve the problem of high scrapping rate of underfill process maintenance, achieve good solderability, ensure product reliability, and bond solid effect

Inactive Publication Date: 2016-02-03
三友(天津)高分子技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the status of the prior art, in order to solve the problem of the high scrap rate of underfill process maintenance, the present invention provides a reworkable epoxy resin flux and its preparation method

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] Embodiment 1 (by weight) formula is:

[0037] 60 parts of solid epoxy resin (Jiangsu Taitel TTA3150)

[0038] 6 parts of dicyandiamide (US gas 1400F)

[0039] 1 part imidazole (commercially available)

[0040] 2 parts of 8-hydroxyquinoline (commercially available)

[0041] 15 parts hydrogenated rosin resin (commercially available)

[0042] 1 part adipic acid (commercially available)

[0043] 0.5 part of fluorocarbon surfactant (DuPont FSO-100, USA)

[0044] 15.5 parts of N,N-dimethylformamide (commercially available).

[0045] The preparation method of the above-mentioned examples is as follows: Weigh the solid epoxy resin, hydrogenated rosin resin, and N,N-dimethylformamide into a three-necked flask, and stir at 100±2°C until the solid epoxy resin and hydrogenated rosin resin are fully Soluble in N,N-dimethylformamide. After cooling to room temperature, sequentially add 8-hydroxyquinoline, dicyandiamide, imidazole, adipic acid or fluorocarbon surfactant and stir...

Embodiment 2

[0046] Embodiment 2 (by weight parts) formula is:

[0047] 50 parts of solid epoxy resin (Jiangsu Taitel TTA3150)

[0048] 4 parts dicyandiamide (US gas 1400F)

[0049] 0.5 part of imidazole adduct (Japan Ajinomoto PN-23)

[0050] 1 part of 8-hydroxyquinoline (commercially available)

[0051] 29 parts of rosin resin (commercially available)

[0052] 0.5 parts of diethylamine hydrochloride (commercially available)

[0053] 0.5 part of fluorocarbon surfactant (DuPont FSO-100, USA)

[0054] 14.5 parts of N-methylpyrrolidone (commercially available).

[0055] The preparation method of the above-mentioned examples is as follows: Weigh the solid epoxy resin, rosin resin, and N-methylpyrrolidone into a three-necked flask, and stir at 100±2°C until the solid epoxy resin and rosin resin are fully dissolved in N-methylpyrrolidone. in pyrrolidone. After cooling to room temperature, sequentially add 8-hydroxyquinoline, dicyandiamide, imidazole adduct, diethylamine hydrochloride or ...

Embodiment 3

[0056] Embodiment 3 (by weight parts) formula is:

[0057] 65 parts of solid epoxy resin (Jiangsu Taitel TTA3150)

[0058] 8 parts of dicyandiamide (US gas 1400F)

[0059] 2.5 parts of imidazole (commercially available)

[0060] 5 parts of 2-methyl-8-hydroxyquinoline (commercially available)

[0061] 10 parts of polymerized rosin resin (commercially available)

[0062] 1 part succinic acid (commercially available)

[0063] 1 part adipic acid (commercially available)

[0064] 0.5 part of fluorocarbon surfactant (DuPont FSO-100, USA)

[0065] 7 parts of N,N-dimethylformamide (commercially available).

[0066]The preparation method of the above-mentioned examples is as follows: Weigh the solid epoxy resin, polymerized rosin resin, and N,N-dimethylformamide into a three-necked flask, and stir at 100±2°C until the solid epoxy resin and polymerized rosin resin are fully Soluble in N,N-dimethylformamide. After cooling to room temperature, add 2-methyl-8-hydroxyquinoline, dicy...

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Abstract

The invention relates to a flux, in particular to a reworkable epoxy resin flux and a preparing method thereof. The flux consists of solid epoxy resin of which the softening point is in a range of 70-120 DEG C, a curing agent, a curing accelerant, a fusing assistant, a film forming agent, an activator, a surfactant and a high-boiling-point solvent. The solid epoxy resin, rosin resin and N-methyl-2-pyrrolidone are weighed, are added into a three-neck flask and are mixed at a temperature of 98DEG C to 102DEG C until the solid epoxy resin and the rosin resin are fully dissolved in the N-methyl-2-pyrrolidone. After the mixture is cooled to a room temperature, 8-hydroxyquinoline, dicyandiamide, imidazole adduct and diethylammonium chloride or a fluorocarbon surfactant are sequentially added and evenly mixed, thereby obtaining the reworkable epoxy resin flux. The flux is heated and cured through reflow soldering, has great solderability and wettability, and can be firmly bonded with a soldering point. Meanwhile, the flux can be removed at a temperature of 100 DEG C or above or can be removed by being wiped with a solvent, so that the flux has great reworking performance.

Description

technical field [0001] The invention relates to a flux, in particular to a reworkable epoxy resin flux and a preparation method. Background technique [0002] Handheld consumer electronic products (such as: mobile phones, tablet computers, digital cameras, etc.) are becoming more and more powerful, but their size and weight are constantly shrinking, which promotes the integration and miniaturization of components and PCBs. The miniaturization of components has enabled the widespread use of flip chips arranged in a matrix of solder balls such as BGA and CSP. Due to the limitation of their structural characteristics, the reliability of such chip solder joints has become a key factor affecting the reliability of current handheld electronic products. . There are two factors that affect the reliability of flip-chip solder joints. One is the physical impact of hand-held consumer electronics products due to drops, vibrations, etc., and the other is the mismatch between the coeffic...

Claims

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Application Information

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IPC IPC(8): B23K35/362B23K35/40
CPCB23K35/362B23K35/3613B23K35/40
Inventor 吴子刚李士学高之香李建武李程闫静邵凯王晓彤
Owner 三友(天津)高分子技术有限公司
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