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Lead-free soldering aid paste

A technology of lead-free solder and solder paste, applied in the direction of welding medium, welding equipment, welding/cutting medium/material, etc., can solve the problems of not being environmentally friendly and easy to cause pollution, and achieve excellent performance, good solderability, solid The effect of low content

Inactive Publication Date: 2014-10-08
东莞升洋焊锡材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Most of the existing solder pastes contain heavy metals such as lead, which are not environmentally friendly and are likely to cause pollution

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0012] A lead-free solder flux paste, characterized in that: it includes the following raw materials in parts by weight: 80 parts of tin, 2 parts of silver, 0.2 parts of copper, 0.1 part of magnesium, 2 parts of dehydrorosin, and 0.2 parts of hexadecyl bromide pyridine , 2 parts of sebacic acid, 2 parts of ethylenediamine, 2 parts of diethylene glycol monobutyl ether, 3 parts of diethylene glycol monohexyl ether, 0.2 parts of bis stearic acid amide, 0.2 parts of BHT, 2, 3 0.2 parts of dibromopropanol.

[0013] The beneficial effects of the invention are: the invention does not contain lead, has good solderability, low solid content, less residue after welding and no need for cleaning. The invention has excellent performance, can overcome the disadvantages of the existing flux, and its use is more in line with the requirements of environmental protection.

Embodiment 2

[0015] A lead-free solder flux paste, characterized in that it includes the following raw materials in parts by weight: 90 parts of tin, 4 parts of silver, 1 part of copper, 0.3 parts of magnesium, 6 parts of dehydrorosin, and 1 part of hexadecyl bromide pyridine , 4 parts of sebacic acid, 3 parts of ethylenediamine, 4 parts of diethylene glycol monobutyl ether, 6 parts of diethylene glycol monohexyl ether, 1 part of bis stearic acid amide, 1 part of BHT, 2,3-dibromo 1 part propanol.

[0016] The beneficial effects of the invention are: the invention does not contain lead, has good solderability, low solid content, less residue after welding and no need for cleaning. The invention has excellent performance, can overcome the disadvantages of the existing flux, and its use is more in line with the requirements of environmental protection.

Embodiment 3

[0018] A lead-free solder flux paste, characterized in that: it includes the following raw materials in parts by weight: 85 parts of tin, 3 parts of silver, 0.6 part of copper, 0.2 part of magnesium, 4 parts of dehydrorosin, and 0.6 part of cetyl bromide , 3 parts of sebacic acid, 2.5 parts of ethylenediamine, 3 parts of diethylene glycol monobutyl ether, 4.5 parts of diethylene glycol monohexyl ether, 0.6 parts of bis stearic acid amide, 0.6 parts of BHT, 2, 3 0.6 part of dibromopropanol.

[0019] The beneficial effects of the invention are: the invention does not contain lead, has good solderability, low solid content, less residue after welding and no need for cleaning. The invention has excellent performance, can overcome the disadvantages of the existing flux, and its use is more in line with the requirements of environmental protection.

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PUM

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Abstract

The invention discloses a lead-free soldering aid paste which is characterized by comprising the following raw materials in parts by weight: 80 to 90 parts of tin, 2 to 4 parts of silver, 0.2 to 1 part of copper, 0.1 to 0.3 part of magnesium, 2 to 6 parts of dehydroabietic acid, 0.2 to 1 part of hexadecyl bromo-pyridine, 2 to 4 parts of sebacic acid, 2 to 3 parts of ethylene diamine, 2 to 4 parts of diethylene glycol monobutyl ether, 3 to 6 parts of DEG (diethylene glycol) monohexyl ether, 0.2 to 1 part of double stearic acid amide, 0.2 to 1 part of BHT, and 0.2 to 1 part of 2,3-dibromo propanol. The lead-free soldering aid paste provided by the invention has the beneficial effects as follows: lead is not contained, the weldability is good, the solid content is low, less residue is left after welding, and cleaning is not required. The lead-free soldering aid paste provided by the invention is excellent in performance, can overcome the defects of a conventional soldering flux, and can meet environmental protection requirements in use.

Description

technical field [0001] The invention relates to the field of metal welding, in particular to a lead-free solder flux paste. Background technique [0002] Flux can remove oxides during the soldering process and reduce the surface tension of the material to be soldered. It is widely used in the soldering of watch instruments, precision components, medical equipment, mobile communications, digital products, and various PCB boards and BGA solder balls. [0003] Solder paste appeared in the surface mount technology (Surface Mount Assembly, referred to as SMT) in the 1970s, which refers to printing and coating solder paste on the pads of printed circuit boards, and accurately attaching surface mount components to On the pads coated with solder paste, the circuit board is heated according to a specific reflow temperature curve to melt the solder paste, and its alloy components are cooled and solidified to form solder joints between components and printed circuit boards to achieve m...

Claims

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Application Information

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IPC IPC(8): B23K35/26B23K35/36
CPCB23K35/3601B23K35/362
Inventor 罗宏强
Owner 东莞升洋焊锡材料有限公司
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