Lead-free soldering aid paste

A technology of lead-free solder and solder paste, applied in the direction of welding medium, welding equipment, welding/cutting medium/material, etc., can solve the problems of not being environmentally friendly and easy to cause pollution, and achieve excellent performance, good solderability, solid The effect of low content

Inactive Publication Date: 2014-10-08
东莞升洋焊锡材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Most of the existing solder pastes contain heavy metals such as lead, w

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0011] Example one:

[0012] A lead-free soldering flux paste, characterized in that it comprises the following raw materials by weight: 80 parts by weight of tin, 2 parts by silver, 0.2 parts by copper, 0.1 parts by magnesium, 2 parts by dehydrogenated rosin, and 0.2 parts by cetyl bromide pyridine ,Sebacic acid 2 parts, ethylene diamine 2 parts, diethylene glycol monobutyl ether 2 parts, diethylene glycol monohexyl ether 3 parts, distearic acid amide 0.2 parts, BHT 0.2 parts, 2, 3 one 0.2 parts of dibromopropanol.

[0013] The beneficial effects of the present invention are: the present invention does not contain lead, has good solderability, low solid content, few residues after welding, and does not need to be cleaned. The invention has excellent performance, can overcome the shortcomings of the existing flux, and its use is more in line with the requirements of environmental protection.

Example Embodiment

[0014] Embodiment two:

[0015] A lead-free soldering flux paste, characterized in that it comprises the following raw materials by weight: 90 parts of tin, 4 parts of silver, 1 part of copper, 0.3 parts of magnesium, 6 parts of dehydrogenated rosin, and 1 part of cetyl bromide pyridine , Sebacic acid 4 parts, Ethylene diamine 3 parts, Diethylene glycol monobutyl ether 4 parts, Diethylene glycol monohexyl ether 6 parts, Distearic acid amide 1 part, BHT 1 part, 2,3-Dibromide 1 part of propanol.

[0016] The beneficial effects of the present invention are: the present invention does not contain lead, has good solderability, low solid content, few residues after welding, and does not need to be cleaned. The invention has excellent performance, can overcome the shortcomings of the existing flux, and its use is more in line with the requirements of environmental protection.

Example Embodiment

[0017] Embodiment three:

[0018] A lead-free soldering flux paste, characterized in that it comprises the following raw materials in parts by weight: 85 parts of tin, 3 parts of silver, 0.6 parts of copper, 0.2 parts of magnesium, 4 parts of dehydrogenated rosin, and 0.6 parts of cetyl bromide pyridine , Sebacic acid 3 parts, ethylene diamine 2.5 parts, diethylene glycol monobutyl ether 3 parts, diethylene glycol monohexyl ether 4.5 parts, distearic acid amide 0.6 parts, BHT 0.6 parts, 2, 3 one 0.6 parts of dibromopropanol.

[0019] The beneficial effects of the present invention are: the present invention does not contain lead, has good solderability, low solid content, few residues after welding, and does not need to be cleaned. The invention has excellent performance, can overcome the shortcomings of the existing flux, and its use is more in line with the requirements of environmental protection.

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PUM

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Abstract

The invention discloses a lead-free soldering aid paste which is characterized by comprising the following raw materials in parts by weight: 80 to 90 parts of tin, 2 to 4 parts of silver, 0.2 to 1 part of copper, 0.1 to 0.3 part of magnesium, 2 to 6 parts of dehydroabietic acid, 0.2 to 1 part of hexadecyl bromo-pyridine, 2 to 4 parts of sebacic acid, 2 to 3 parts of ethylene diamine, 2 to 4 parts of diethylene glycol monobutyl ether, 3 to 6 parts of DEG (diethylene glycol) monohexyl ether, 0.2 to 1 part of double stearic acid amide, 0.2 to 1 part of BHT, and 0.2 to 1 part of 2,3-dibromo propanol. The lead-free soldering aid paste provided by the invention has the beneficial effects as follows: lead is not contained, the weldability is good, the solid content is low, less residue is left after welding, and cleaning is not required. The lead-free soldering aid paste provided by the invention is excellent in performance, can overcome the defects of a conventional soldering flux, and can meet environmental protection requirements in use.

Description

technical field [0001] The invention relates to the field of metal welding, in particular to a lead-free solder flux paste. Background technique [0002] Flux can remove oxides during the soldering process and reduce the surface tension of the material to be soldered. It is widely used in the soldering of watch instruments, precision components, medical equipment, mobile communications, digital products, and various PCB boards and BGA solder balls. [0003] Solder paste appeared in the surface mount technology (Surface Mount Assembly, referred to as SMT) in the 1970s, which refers to printing and coating solder paste on the pads of printed circuit boards, and accurately attaching surface mount components to On the pads coated with solder paste, the circuit board is heated according to a specific reflow temperature curve to melt the solder paste, and its alloy components are cooled and solidified to form solder joints between components and printed circuit boards to achieve m...

Claims

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Application Information

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IPC IPC(8): B23K35/26B23K35/36
CPCB23K35/3601B23K35/362
Inventor 罗宏强
Owner 东莞升洋焊锡材料有限公司
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