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Positive photoresist composition

A positive photoresist and composition technology, which is applied in optics, optomechanical equipment, photosensitive materials for optomechanical equipment, etc. Accuracy and other issues, to achieve the effect of high image resolution, high photosensitive speed, and uniform film layer

Inactive Publication Date: 2016-02-03
BEIJING ZHONGKEZIXIN TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the existing technology, the surface of the film layer is easy to shrink after the high temperature treatment of the photoresist after post-baking, which makes the photoresist coating uneven
In this way, when applied to genome sequencing, the photoresist is coated on the chip, which will affect the detection accuracy and cause inaccurate results.

Method used

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  • Positive photoresist composition

Examples

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Comparison scheme
Effect test

Embodiment 1

[0015] The composition by weight is 0.4 parts of ETA-735, 4 parts of tetrahydrofuran, 16 parts of propylene glycol methyl ether acetate, 5 parts of dimethylacetamide, 2 parts of diazonaphthoquinone sulfonate, 4 parts of methyl 2-hydroxyethyl acrylate 2 parts, 2 parts of trimethylolpropane trimethacrylate and 12 parts of n-butyl methacrylate.

Embodiment 2

[0017] The composition by weight is 0.55 parts of ETA-735, 4 parts of tetrahydrofuran, 14 parts of propylene glycol methyl ether acetate, 4 parts of dimethylacetamide, 2 parts of diazonaphthoquinone sulfonate, 3 parts of methyl 2-hydroxyethyl acrylate 3 parts, 3 parts of trimethylolpropane trimethacrylate and 10 parts of n-butyl methacrylate.

Embodiment 3

[0019] The composition by weight is 0.5 parts of ETA-735, 4 parts of tetrahydrofuran, 14 parts of propylene glycol methyl ether acetate, 7 parts of dimethylacetamide, 3 parts of diazonaphthoquinone sulfonate, 5 parts of methyl 2-hydroxyethyl acrylate 8 parts, 8 parts of trimethylolpropane trimethacrylate and 4 parts of n-butyl methacrylate.

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Abstract

The invention discloses a positive photoresist composition. The composition comprises 0.4-0.55 parts of an organosilicon flatting agent, 23-25 parts of a solvent, 2-3 parts of an optical active substance and 16-18 parts of resin. The solvent contains tetrahydrofuran, 2-acetoxy-1-methoxypropane and dimethyl acetamide. The prepared positive photoresist has a higher photosensitive speed, and is suitable for large scale popularization and application.

Description

technical field [0001] The invention belongs to the technical field of photoresist materials, and in particular relates to a positive photoresist composition. Background technique [0002] Photoresist, also known as photoresist, is a light-sensitive mixed liquid composed of three main components: photosensitive resin, sensitizer and solvent. After the photosensitive resin is exposed to light, the photocuring reaction can quickly occur in the exposed area, so that the physical properties of the material, especially the solubility and affinity, will change significantly. After being treated with an appropriate solvent, the soluble part is dissolved to obtain the desired image. The technology of photoresist is complicated and there are many varieties. According to its chemical reaction mechanism and development principle, it can be divided into two types: negative gel and positive gel. It is negative gel that forms insoluble substance after light; on the contrary, it is inso...

Claims

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Application Information

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IPC IPC(8): G03F7/039G03F7/027G03F7/004
Inventor 陈哲任鲁风殷金龙
Owner BEIJING ZHONGKEZIXIN TECH
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