Epoxy resin composition and prepreg and copper clad laminate manufactured by using epoxy resin composition
A technology of epoxy resin and prepreg, which is applied in the field of resin composition, can solve problems such as high brittleness, low thermal decomposition temperature, and poor PCB processability, and achieve high glass transition temperature, good impact toughness, and excellent dielectric properties.
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Embodiment 1
[0054] 100 parts by weight of HP-7200HHH (dicyclopentadiene type novolac epoxy resin, epoxy equivalent: 286g / eq), then add 74.1 parts by weight of HPC-8000-65T (active ester compound, active ester equivalent: 223g / eq) , then add 5.4 parts by weight of ELASMER-1000P (poly-1,4-butanediol bis(4-aminobenzoate, active hydrogen equivalent is 309g / eq), mix and stir and add an appropriate amount of curing accelerator DMAP, and Solvent toluene, continue to stir evenly to form glue, control the solid content of glue to be 40-80%.Impregnate the above glue with glass fiber cloth (model is 2116, thickness is 0.08mm), and control to a suitable thickness, then dry Remove the solvent to make a prepreg. Use several prepared prepregs to stack each other, press a piece of copper foil on each side of the prepreg, put it into a hot press and solidify to make the copper-clad laminate. Physical data As shown in Table 1.
Embodiment 2
[0056] 100 parts by weight of HP-7200HHH (dicyclopentadiene type novolak epoxy resin, epoxy equivalent: 286g / eq), then add 70.2 parts by weight of HPC-8000-65T (active ester compound, active ester equivalent: 223g / eq) , then add 10.8 parts by weight of ELASMER-1000P (poly-1,4-butanediol bis(4-aminobenzoate active hydrogen equivalent is 309g / eq), mix and stir and add an appropriate amount of curing accelerator DMAP, and solvent Toluene, continue to stir evenly to form the glue, control the solid content of the glue to be 40-80%.Impregnate the above-mentioned glue with glass fiber cloth (the model is 2116, and the thickness is 0.08mm), and control to a suitable thickness, then dry and remove Solvent makes prepregs. Use several prepared prepregs to stack each other, press and cover a piece of copper foil on both sides, put it into a hot press and solidify to make the copper-clad laminate. The physical data is as follows: Table 1 shows.
Embodiment 3
[0058] 100 parts by weight of HP-7200HHH (dicyclopentadiene type novolac epoxy resin, epoxy equivalent: 286g / eq), then add 54.6 parts by weight of HPC-8000-65T (active ester compound, active ester equivalent: 223g / eq) , then add 32.4 parts by weight of ELASMER-1000P (poly-1,4-butanediol bis(4-aminobenzoate, active hydrogen equivalent is 309g / eq), mix and stir and add an appropriate amount of curing accelerator DMAP, and Solvent toluene, continue to stir evenly to form glue, control the solid content of glue to be 40-80%.Impregnate the above glue with glass fiber cloth (model is 2116, thickness is 0.08mm), and control to a suitable thickness, then dry Remove the solvent to make a prepreg. Use several prepared prepregs to stack each other, press a piece of copper foil on each side of the prepreg, put it into a hot press and solidify to make the copper-clad laminate. Physical data As shown in Table 1.
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