A kind of radiation protection board and preparation method thereof
A technology of radiation protection and floor layer, applied in the field of building materials, can solve the problems of increased thickness, high price, excessive weight, etc., and achieve the effect of low thickness, low material cost, and reduced material thickness
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0092] The commercially available aluminum-plastic plate is the bottom layer with a thickness of 1mm; the first conductive plastic mesh layer with a pore diameter of 5 mesh and a thickness of 1mm is prepared by mixing carbon black and PE at a weight ratio of 22:78 in a kneading machine and film pressing. Control the square resistance at 190Ω / □; mix carbon black and PE at a ratio of 18:82 in a kneader and prepare the second conductive plastic mesh layer with a pore size of 8 meshes and a thickness of 1mm, and control the square resistance at 420Ω / □ □; take the PC surface layer as the protective layer with a thickness of 1mm; the distance between each layer is 2cm, and the air layer in the middle is used for heat dissipation and heat insulation. According to the size of the overall board, there are metal plates around it for fixing, and each layer is connected to the fixing board. Two water leakage holes can be designed in the lower part; two ventilation holes can be designed on...
Embodiment 2
[0095] The commercially available aluminum-plastic plate is the bottom layer with a thickness of 1.5mm; the first conductive plastic mesh layer with a pore size of 6 mesh and a thickness of 0.5mm is prepared by mixing carbon fiber and PVC at a weight ratio of 38:62 in a kneading machine and film pressure The square resistance is controlled at 200Ω / □; carbon fiber and PVC are mixed in a mixing machine at a ratio of 30:70, and the membrane pressure is prepared to obtain the second conductive plastic mesh layer with a pore diameter of 7 mesh and a thickness of 0.5mm. The square resistance is controlled at 400Ω / □; take the PC surface layer as the protective layer with a thickness of 0.5mm; the distance between each layer is 1.9cm, and the air layer for heat dissipation and heat insulation in the middle. According to the size of the overall board, there are metal plates around it for fixing, and each layer is connected to the fixing board. A radiation shield is obtained as a whole...
Embodiment 3
[0098] The commercially available aluminum-plastic plate is the base layer with a thickness of 1.6mm; the first conductive plastic net with a pore diameter of 6 mesh and a thickness of 0.3mm is prepared by mixing carbon black and PVC in a weight ratio of 33:67 in a kneading machine and film pressing layer, the control square resistance is 220Ω / □; carbon fiber and PVC are mixed in a mixing machine at a ratio of 30:70, and the membrane pressure is prepared to obtain the second conductive plastic mesh layer with an aperture of 7 mesh and a thickness of 0.4mm. The control square resistance is at 390Ω / □; the PC surface layer is used as a protective layer with a thickness of 0.8mm; the distance between each layer is 2.1cm, and the air layer is in the middle for heat dissipation and heat insulation. According to the size of the overall board, there are metal plates around it for fixing, and each layer is connected to the fixing board. A radiation shield is obtained as a whole.
[00...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More 

