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Heat-conduction mixed polymer and preparation method thereof

A technology of blending polymer and polyacrylic acid, used in the field of chemical product manufacturing, can solve the problems of increased thermal conductivity, high viscosity of the system, and severe decline in electrical insulation, achieving low dielectric loss factor, reducing interface thermal resistance, The effect of excellent electrical insulation

Inactive Publication Date: 2016-03-02
XIAN UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] At present, thermally conductive polymer materials mainly use inorganic particles with high thermal conductivity to fill the polymeric matrix. Due to the extremely low thermal conductivity of the polymer itself, it is generally necessary for the thermal conductivity of the system to increase significantly when the amount of thermally conductive inorganic particles reaches more than 60wt%. , when the thermal conductivity increases, the mechanical properties of the material will decrease, and the impact toughness will be severely reduced. Moreover, due to the use of a large number of inorganic particles, the electrical insulation of the system will drop sharply, and the viscosity of the system will increase, resulting in poor processing performance.
However, the improvement of the thermal conductivity of a single polymer system is currently mainly achieved by stretching and electrospinning stretching to achieve directional alignment of molecular chains. This method is too expensive to achieve industrial production and is only in the experimental stage.

Method used

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  • Heat-conduction mixed polymer and preparation method thereof

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preparation example Construction

[0025] The preparation method of the above-mentioned high thermal conductivity blended polymer comprises the following steps:

[0026] 1) Preparation of mixed polymer solution

[0027] Dissolve poly-N-acryloylpiperidine (poly(N-acryloylpiperidine)) with a weight-average molecular weight of 8000-10000 in N-N, dimethylformamide solution, and prepare poly-N-acryloylpiperidine with a mass concentration of 3-5%. N-acryloylpiperidine solution: dissolving polyacrylic acid with a weight-average molecular weight of about 200,000-220,000 in N-N, dimethylformamide solution to form a polyacrylic acid solution with a mass concentration of 1-1.5%.

[0028] According to the mass percentage of poly-N-acryloyl piperidine: polyacrylic acid=(40-45%): (55-60%), mix poly-N-acryloyl piperidine solution and polyacrylic acid solution, and mechanically stir at room temperature for 2 -4h, a mixed solution was obtained.

[0029] 2) Spin coating film production

[0030] The mixed solution is spin-coat...

Embodiment 1

[0034] A method for preparing a thermally conductive blended polymer, comprising the following steps:

[0035] 1) Preparation of mixed polymer solution

[0036] Dissolving poly-N-acryloylpiperidine with a weight-average molecular weight of 8000-10000 in N-N, dimethylformamide solution to form a poly-N-acryloylpiperidine solution with a mass concentration of 3%; Polyacrylic acid with an average molecular weight of about 200,000-220,000 is dissolved in N-N, dimethylformamide solution to form a polyacrylic acid solution with a mass concentration of 1.5%.

[0037] According to the mass percentage of poly-N-acryloylpiperidine: polyacrylic acid = 45%: 55%, the poly-N-acryloylpiperidine solution and the polyacrylic acid solution were mixed, and mechanically stirred at room temperature for 2 hours to obtain a mixed solution.

[0038] 2) Spin coating film production

[0039] The mixed solution was spin-coated on a clean substrate on a spin-coating device at a rotation speed of 1300 r...

Embodiment 2

[0043] A method for preparing a thermally conductive blended polymer, comprising the following steps:

[0044] 1) Preparation of mixed polymer solution

[0045] Dissolve poly-N-acryloylpiperidine with a weight average molecular weight of 9000 in N-N, dimethylformamide solution to form a poly-N-acryloylpiperidine solution with a mass concentration of 3%; About 200,000 polyacrylic acid is dissolved in N-N, dimethylformamide solution to form a polyacrylic acid solution with a mass concentration of 1.0%.

[0046]According to the mass percentage of poly-N-acryloylpiperidine:polyacrylic acid=40%:60%, the poly-N-acryloylpiperidine solution and the polyacrylic acid solution were mixed, and mechanically stirred for 3 hours at room temperature to obtain a mixed solution.

[0047] 2) Spin coating film production

[0048] The mixed solution was spin-coated on a clean substrate on a spin-coating device at a rotation speed of 1400 rpm for 20 s. Stand still for 10 hours after coating to o...

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Abstract

The invention discloses a heat-conduction mixed polymer and a preparation method thereof. The preparation method comprises dissolving poly-N-acryloylpiperidine in N, N-dimethylformamide to obtain a poly-N-acryloylpiperidine solution, dissolving polyacrylic acid in N, N-dimethylformamide to obtain a polyacrylic acid solution, stirring the poly-N-acryloylpiperidine solution and the polyacrylic acid solution according to a mass percent ratio of poly-N-acryloylpiperidine to polyacrylic acid of (40-45%): (55-60%) to obtain a uniform solution, carrying out spin coating on a clean substrate with the uniform solution to obtain a film on the substrate, carrying out film peeling and lamination, then carrying out hot pressing and carrying out cooling to obtain the heat-conduction mixed polymer. Through intermolecular hydrogen bonds and chain structures of two kinds of the low-thermal conductivity polymers, high mixed polymer thermal conductivity is obtained and the highest thermal conductivity is in a range of 0.8-1.0W / (m.K). The heat-conduction mixed polymer has very high electrical insulating properties, good processing performances and realizes high thermal conductivity of the mixed polymer.

Description

technical field [0001] The invention belongs to the technical field of chemical product manufacturing, and relates to a heat-conducting blended polymer material, in particular to a heat-conducting blended polymer and a preparation method thereof. Background technique [0002] At present, thermally conductive polymer materials mainly use inorganic particles with high thermal conductivity to fill the polymeric matrix. Due to the extremely low thermal conductivity of the polymer itself, it is generally necessary for the thermal conductivity of the system to increase significantly when the amount of thermally conductive inorganic particles reaches more than 60wt%. , when the thermal conductivity increases, the mechanical properties of the material will decrease, and the impact toughness will be seriously reduced. Moreover, due to the use of a large number of inorganic particles, the electrical insulation of the system will drop sharply, and the viscosity of the system will increa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L33/02C08L33/00
CPCC08L33/02C08L2201/10C08L33/00
Inventor 周文英徐丽
Owner XIAN UNIV OF SCI & TECH