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Method for preparing antibacterial epoxy resin pouring sealant

A technology of epoxy resin and potting glue, applied in the field of potting glue, can solve the problems of lack of antibacterial properties and inability to use

Active Publication Date: 2016-03-02
TAIZHOU HONGLIN IND DESIGN CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the epoxy resin potting compound also does not have antibacterial properties and cannot be used in occasions with very high antibacterial requirements

Method used

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  • Method for preparing antibacterial epoxy resin pouring sealant
  • Method for preparing antibacterial epoxy resin pouring sealant

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] The preparation method of antibacterial epoxy resin potting glue, its steps are as follows:

[0030] (1) Ginkgo biloba is placed in an oven at 70° C. and dried for 2 hours, and after being pulverized with a pulverizer, 50 mesh sieves are obtained to obtain Ginkgo biloba powder, and the Ginkgo biloba powder is added to the ethanol solution with a mass concentration of 75%, and Ginkgo biloba and The weight-to-volume ratio of the ethanol solution is 1:9g / mL, the temperature is 40°C, and the ultrasonic frequency is 40KHz, ultrasonic extraction is performed for 1 hour, and the filtrate is obtained by filtering after standing for 3 hours, and the filtrate is concentrated in a constant temperature water bath at 50°C 2 hours, obtain the Ginkgo biloba extract for subsequent use;

[0031] (2) Add diatomaceous earth with a weight ratio of 1:2 and the ginkgo biloba extract obtained in step (1) into a mixer, heat to 70°C and stir magnetically for 3 hours, take it out and place it in...

Embodiment 2

[0037] The preparation method of antibacterial epoxy resin potting glue, its steps are as follows:

[0038] (1) Ginkgo biloba is placed in an oven at 70° C. to dry for 2 hours, and after being pulverized with a pulverizer, 50 mesh sieves are obtained to obtain Ginkgo biloba powder, and Ginkgo biloba powder is added to the ethanol solution with a mass concentration of 75%, and Ginkgo biloba and The weight-to-volume ratio of the ethanol solution is 1:9g / mL, the temperature is 40°C, and the ultrasonic frequency is 40KHz, ultrasonic extraction is carried out for 1 hour, and the filtrate is obtained by filtering after standing for 3 hours, and the filtrate is concentrated in a constant temperature water bath at 50°C 2 hours, obtain the Ginkgo biloba extract for subsequent use;

[0039] (2) Add diatomaceous earth with a weight ratio of 1:2 and the ginkgo biloba extract obtained in step (1) into a mixer, heat to 70°C and stir magnetically for 3 hours, take it out and place it in a va...

Embodiment 3

[0045] The preparation method of antibacterial epoxy resin potting glue, its steps are as follows:

[0046] (1) Ginkgo biloba is placed in an oven at 70° C. and dried for 2 hours, and after being pulverized with a pulverizer, 50 mesh sieves are obtained to obtain Ginkgo biloba powder, and the Ginkgo biloba powder is added to the ethanol solution with a mass concentration of 75%, and Ginkgo biloba and The weight-to-volume ratio of the ethanol solution is 1:9g / mL, the temperature is 40°C, and the ultrasonic frequency is 40KHz, ultrasonic extraction is performed for 1 hour, and the filtrate is obtained by filtering after standing for 3 hours, and the filtrate is concentrated in a constant temperature water bath at 50°C 2 hours, obtain the Ginkgo biloba extract for subsequent use;

[0047] (2) Add diatomaceous earth with a weight ratio of 1:2 and the ginkgo biloba extract obtained in step (1) into a mixer, heat to 70°C and stir magnetically for 3 hours, take it out and place it in...

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Abstract

The invention provides a method for preparing an antibacterial epoxy resin pouring sealant. The method comprises the following steps: 1) drying ginkgo leaves, crushing the ginkgo leaves and sieving to obtain the ginkgo leaves powder, adding an ethyl alcohol solution, performing ultrasonic extraction, standing and filtering the material, concentrating the material to obtain a ginkgo leaves extract product; 2) adding diatomite and the ginkgo leaves extract product in a mixer, heating the materials and performing magnetic stirring, taking the product out and drying the product, grinding the product and sieving the product to obtain a composite antiseptic; 3) preparing a mixed liquor by the composite antiseptic, heating the mixed liquor, adding an aluminic acid ester coupling agent, stirring the materials, performing pumping filtration, drying the materials to obtain the modified composite antiseptic; 4) adding epoxy resin, a flexibilizer, a diluents, a filling material and the modified composite antiseptic in a stirred tank for stirring the above materials, performing vacuum defoaming to obtain a component A; 5) adding a curing agent and a promoter in the stirred tank for stirring the above materials, performing vacuum defoaming to obtain a component B; and 6) uniformly mixing the component A and the component B to obtain the antibacterial epoxy resin pouring sealant. The prepared antibacterial epoxy resin pouring sealant has good antibacterial property.

Description

Technical field: [0001] The invention relates to a potting glue, in particular to a preparation method of an antibacterial epoxy resin potting glue. Background technique: [0002] Epoxy resin potting glue refers to a type of epoxy resin liquid packaging or potting material made of epoxy resin as the main component, adding various functional additives, and matching with a suitable curing agent. According to its different composition, it is mainly divided into two types, one is a one-component epoxy potting glue; the other is a two-component epoxy potting glue. According to the color, it can be divided into transparent, black and milky white, etc. According to the mixing ratio, there are generally 1:1, 2:1, 3:1 and black 4:1 or 5:1. [0003] One-component epoxy potting glue is a kind of medium-temperature or high-temperature-curing variety formulated with latent epoxy curing agent. Its curing conditions often need to be heated to cure, and its storage conditions are generally...

Claims

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Application Information

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IPC IPC(8): C09J163/02C09J11/06
Inventor 李晓明
Owner TAIZHOU HONGLIN IND DESIGN CO LTD
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