Preparing method of submicrometer spherical silicon dioxide micropowder

Abstract

The invention belongs to a preparing method of submicrometer spherical silicon dioxide micropowder. Silicon-containing inorganic compound powder serves as a raw material, a specific area of the raw material is larger than or equal to 1.3m<2> / g and smaller than or equal to 13m<2> / g, and a ratio of D90 to D10 is smaller than 15; oxygen or air serves as a carrier gas, liquefied natural gas is an inflammable gas, oxygen serves as a combustion improver, the liquefied natural gas and oxygen are respectively guided into a burning furnace and ignited, the raw material enters the burning furnace under the protection of the carrier gas and are spherized to prepare silicon dioxide micropowder with an average particle size D50 being equal to 0.3-3mum. The degree of sphericity of the prepared silicon dioxide micropowder is high, the average particle size D50 being equal to 0.3-3mum can be obtained, so the filling capacity and liquidity are good, the preparing method is simple and a preparing process is safe and environment-friendly.

Description

technical field [0001] The invention relates to a method for preparing silicon dioxide, in particular to a method for preparing submicron spherical silicon dioxide micropowder by using silicon-containing inorganic compound powder as a raw material. Background technique [0002] With the development of miniaturization and thinning of electronic equipment, the particle size of fillers for semiconductor packaging is expected to be smaller and smaller. In order to improve the filling amount and fluidity of fillers in semiconductor packaging, it is necessary to prepare submicron fillers with high sphericity. [0003] In the prior art: the patent No. 200410012854.8 is based on the reaction of silicate or alkaline silica sol with acid, stirring, standing and aging, separation, washing and drying to obtain submicron and nanometer particle size of 5 μm-10nm Spherical silica powder; [0004] The patent with application number 201410015493.6 is based on organosilicate as raw material,...

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Problems solved by technology

[0007] The first two patents belong to the reaction in the solution. The organic matter, acid, alkali and the waste materials and waste water produced are relatively polluting to the environment. They are not suitable for large-scale production and do not meet the current environmental protection requirements. The third patent product is spherical Carbon, one of the raw materials used, is easily mixed into SiO gas, resulting in a decrease in product purity, and the conductivity of carbon causes serious failure of semiconductor packaging. The fourth patent uses metal silicon to prepare submicron spherical silica powder. During the process Explosion will occur, the temperature will rise sharply, and the requirements for equipment are high. At the same time, it will also cause dust explosion, and the safety is poor.