Microwave anechoic chamber and shielding case assembly structure thereof

Abstract

The invention discloses a shielding case assembly structure of a microwave anechoic chamber and the microwave anechoic chamber with the shielding case assembly structure. The shielding case assembly structure comprises one or more pairs of first splicing units and second splicing units all with the electromagnetic shielding property, wherein the first splicing units and the second splicing units are mutually spliced, at least the outer surfaces of the first splicing units and the outer surfaces of the second splicing units are made of non-ferromagnetic metal material, and the joints of the first splicing units and the second splicing units are spliced in a non-conduction mode. The inner sides of the joints are covered with loss layers, the outer sides of the joints are covered with shielding layers, the loss layers are made of non-magnetic wave-absorbing material, and the shielding layers are used for shielding external electromagnetic waves. The shielding case assembly structure can reliably avoid intermodulation interference and improve the property of shielding the electromagnetic waves.

Description

technical field [0001] The invention relates to the technical field of testing in the communication industry, in particular to a shielding case assembly structure of a microwave anechoic chamber and a microwave anechoic chamber with the shielding case assembly structure. Background technique [0002] Passive Inter-Modulation (PIM for short) is caused by nonlinear characteristics of various passive components in the transmission system. In high-power, multi-channel systems, the nonlinearity of these passive components generates higher harmonics relative to the operating frequency, and these harmonics mix with the operating frequency to generate a new set of frequencies. A set of useless spectrum is generated in the network, which affects normal communication. [0003] In passive devices (antennas, cables, etc.), the causes of passive intermodulation mainly include three aspects: bad mechanical nodes, hysteresis characteristics of materials, and contamination of surfaces or c...

AI Technical Summary

Problems solved by technology

This assembly method can effectively avoid the formation of large-area strong intermodulation sources in the darkroom. However, the insulating coating in this structure is easily scratched by the edges and burrs of the aluminum alloy plate, resulting in gaps between the aluminum alloy shielding layer and the shielding rubber strip. The aluminum foil is short-circuited. In addition, due to the gap at the seam of the shielding layer, the intermodulation source from outside the darkroom will enter the darkroom and cause intermodulation interference.

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