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LED packaging material

A technology of LED encapsulation and methylphenyldichlorosilane, which is applied to electrical components, circuits, semiconductor devices, etc., can solve problems such as fatigue, yellowing, and poor heat dissipation, and achieve the effect of increasing the refractive index

Inactive Publication Date: 2016-03-16
殷志杰
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to its own problems such as poor heat and humidity resistance and weather resistance, brittleness, fatigue, low impact toughness and poor heat dissipation performance, it is prone to yellowing under ultraviolet light and high temperature conditions, and is not easy to dissipate heat. Both lead to a reduction in the service life of LED devices

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0014] The LED packaging material in this embodiment is composed of the following components in parts by mass: 15 parts of methylphenyl dichlorosilane, 6 parts of methyl high phenyl vinyl silicone resin, and bisphenol A epoxy resin of 4 parts, 18 parts of diethylaminopropylamine, 8 parts of methylphenyl dichlorosilane, 3 parts of mercapto-containing silsesquioxane compound, and 6 parts of sorbitol fatty acid ester.

[0015] The above-mentioned encapsulation preparation method comprises the following steps:

[0016] (1) Take the methylphenyl dichlorosilane, methyl high phenyl vinyl silicone resin, methylphenyl dichlorosilane, and mercapto-containing silsesquioxane compounds of the above-mentioned parts by mass; Dichlorosilane, methyl high phenyl vinyl silicone resin, methylphenyldichlorosilane, and mercapto-containing silsesquioxane compound are dissolved after heating, and stirred until mixed evenly after dissolving;

[0017] (2) Add bisphenol A type epoxy resin, diethylamino...

Embodiment 2

[0022] The LED packaging material in this embodiment is composed of the following components in parts by mass: 17 parts of methylphenyl dichlorosilane, 9 parts of methyl high phenyl vinyl silicone resin, and 9 parts of bisphenol A epoxy resin 6 parts, 20 parts of diethylaminopropylamine, 9 parts of methylphenyldichlorosilane, and 4 parts of mercapto-containing silsesquioxane compound.

[0023] The above-mentioned encapsulation preparation method comprises the following steps:

[0024] (1) Take the methylphenyl dichlorosilane, methyl high phenyl vinyl silicone resin, methylphenyl dichlorosilane, and mercapto-containing silsesquioxane compounds of the above-mentioned parts by mass; Dichlorosilane, methyl high phenyl vinyl silicone resin, methylphenyldichlorosilane, and mercapto-containing silsesquioxane compound are dissolved after heating, and stirred until mixed evenly after dissolving;

[0025] (2) Add bisphenol A type epoxy resin, diethylaminopropylamine, sorbitol fatty aci...

Embodiment 3

[0030] The LED packaging material in this embodiment is composed of the following components in parts by mass: 19 parts of methylphenyl dichlorosilane, 12 parts of methyl high phenyl vinyl silicone resin, and 12 parts of bisphenol A epoxy resin. 8 parts, 22 parts of diethylaminopropylamine, 10 parts of methylphenyl dichlorosilane, 5 parts of mercapto-containing silsesquioxane compound, and 6 parts of sorbitol fatty acid ester.

[0031] The above-mentioned encapsulation preparation method comprises the following steps:

[0032] (1) Take the methylphenyl dichlorosilane, methyl high phenyl vinyl silicone resin, methylphenyl dichlorosilane, and mercapto-containing silsesquioxane compounds of the above-mentioned parts by mass; Dichlorosilane, methyl high phenyl vinyl silicone resin, methylphenyldichlorosilane, and mercapto-containing silsesquioxane compound are dissolved after heating, and stirred until mixed evenly after dissolving;

[0033] (2) Add bisphenol A type epoxy resin, ...

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Abstract

The invention relates to an LED packaging material. The LED packaging material comprises, by mass, 15 to 19 parts of dichloromethyl phenylsilane, 6 to 12 parts of methyl high-phenyl vinyl silicone resin, 4 to 8 parts of bisphenol A type epoxy resin, 18 to 22 parts of diethylaminopropylanmine, 8 to 10 parts of dichloromethyl phenylsilane, 3 to 5 parts of a silsesquioxane compound containing a mercapto group and 5 to 7 parts of sorbitol fatty acid ester. According to the invention, through optimization of a light emitting diode material, the refractive index, hardness and bonding strength of a light emitting diode are substantially improved. The LED packaging material prepared in the invention has a refractive index of 1.64 to 1.69, Shore hardness of 64A to 72A and bonding strength of 6.6 MPa to 7.4 MPa.

Description

technical field [0001] The invention relates to an LED packaging material and belongs to the technical field of LEDs. Background technique [0002] LED is a new generation of green environmental protection products, widely used in automobiles, lighting, electronic equipment backlight, traffic lights and other fields. In order to protect the chip, prevent the adverse factors of the external environment from causing damage to the chip, and prolong the service life of the LED, the chip is packaged. At present, the traditional material used for LED packaging is epoxy resin, which is cheap and widely used, and the resin itself has excellent electrical insulation, sealing, dielectric properties, adhesion and other characteristics, making it occupy a large market share in the domestic packaging market. Quite a large proportion. However, due to its own problems such as poor heat and humidity resistance and weather resistance, brittleness, fatigue, low impact toughness and poor hea...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08L63/00C08K5/549C08K5/5419C08G59/58C08G59/42H01L33/56
CPCC08L83/04C08G59/4207C08G59/58H01L33/56
Inventor 不公告发明人
Owner 殷志杰
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