Radiographic Measurement Method of Film Thickness Distribution and Its Uniformity

A measurement method and technology of film thickness, which are applied in measurement devices, use of wave/particle radiation, material analysis using radiation, etc., can solve the problems of lack of measurement methods and measurement methods for the uniformity of film mass and thickness distribution, and achieve stable measurement results. reliable results

Inactive Publication Date: 2017-11-07
SICHUAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] The purpose of the present invention is to break through the current technical problem of the lack of measurement methods and means for the uniformity of film quality and thickness distribution, and to achieve this breakthrough by proposing a ray measurement method with high measurement accuracy

Method used

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  • Radiographic Measurement Method of Film Thickness Distribution and Its Uniformity
  • Radiographic Measurement Method of Film Thickness Distribution and Its Uniformity
  • Radiographic Measurement Method of Film Thickness Distribution and Its Uniformity

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Embodiment

[0037] The construction process of the measuring device used in the measurement method of film mass thickness distribution and its uniformity described in this embodiment: the radiation source 14 and the two-dimensional electronically controlled displacement platform 10 are respectively installed on the bottom of the vacuum chamber 16 through the bracket, and the radiation source Place the collimator 13 above the collimator 14, so that the heavy charged particles emitted by the radioactive source 14 shoot the heavy charged particle beam vertically upwards along the collimation hole of the collimator 13; To measure the thin film 9, the heavy charged particle beam emitted from the collimator 13 is vertically incident and passes through the thin film 9 to be measured; a detector 1 is installed in the direction in which the thin film 9 to be measured emits the heavy charged particle beam, and the signal on the detector 1 is output The line is connected to the preamplifier 2; outsid...

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Abstract

The invention discloses a ray measurement method for film thickness distribution and uniformity. The method includes: adopting an alpha particle beam and automatic successive scanning measurement combined method, controlling the scanning measurement movement of a to-be-measured film in the X direction and Y direction within a two-dimensional plane by a computer control system to obtain the energy loss value of the alpha particle beam passing through each small patch of film surface element in order; further calculating the mass thickness value of each film surface element through the energy loss value, and conducting analysis treatment by self-compiled computer software to obtain the graphic representation of the whole to-be-measured film's mass thickness distribution and its uniformity. The new method put forward by the invention can effectively solve the disadvantage that existing methods cannot analyze film mass thickness distribution and its uniformity, provides a new method and technology for analyzing the mass thickness distribution and uniformity of films with thickness ranging from dozens of nanometers to dozens of micrometers, and can be widely applied in film development organizations and film use organizations.

Description

technical field [0001] The invention relates to a measurement technology of film thickness distribution and its uniformity, in particular to a new ray measurement method of film mass thickness distribution and its uniformity based on the combination of heavily charged particle beam and automatic successive scanning measurement. Background technique [0002] In recent decades, thin film preparation science and technology have achieved vigorous development. Thin films prepared by various film-forming methods such as vacuum evaporation, magnetron sputtering, and molecular beam epitaxy have been applied to almost all scientific and technical fields including electronic information, energy, aerospace, and even laser inertial confinement fusion ( ICF) such high-tech fields. The wide application of thin film materials is due to their different physical and chemical properties compared with bulk materials of the same material, and these properties are not only related to the thickn...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N23/06G01B15/02
Inventor 徐家云白立新黎刚
Owner SICHUAN UNIV
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