High-thermal-conductivity organic silicon adhesive doped with multiple carbon materials and preparation method of adhesive

Abstract

The invention discloses a high-thermal-conductivity organic silicon adhesive doped with multiple carbon materials and a preparation method of the adhesive, relates to an organic silicon adhesive and a preparation method thereof, and aims to solve the problem that an existing organic silicon adhesive is lower in heat conductivity coefficient. The adhesive is prepared from silicone rubber, silicone oil, carbon powder, short carbon fiber, carbon nano tubes, a surfactant, a silane coupling agent, an alkynol inhibitor and an organic solvent. The method comprises the steps of 1, weighing the silicone rubber, the silicone oil, the carbon powder, the short carbon fiber, the carbon nano tubes, the surfactant, the silane coupling agent, the alkynol inhibitor and the organic solvent; 2, chemically grafting the carbon nano tubes to the short carbon fiber; 3, performing surface treatment on a thermally conductive filler; 4, mixing the silicone rubber and the silicone oil evenly by an open mill, then adding the thermally conductive filler obtained in step 3 via a three-roller grinder, mixing evenly, and then mixing the silane coupling agent, the alkynol inhibitor and the organic solvent, thus obtaining the high-thermal-conductivity organic silicon adhesive. The method is used for preparing the organic silicon adhesive.

Description

technical field [0001] The invention relates to a silicone adhesive and a preparation method thereof. Background technique [0002] With the rapid development of aerospace science and technology, newer and higher requirements are put forward for thermal conductive materials. High-efficiency heat transfer technology is an important means of spacecraft thermal control. With the increase of the internal components of the spacecraft and the power consumption of the whole star, the original heat transfer technology needs to improve its capacity or develop a new high-efficiency heat transfer technology; the development and application of new payloads require the heat transfer technology to improve its adaptability, Broaden the scope of application. Silicone rubber material with high thermal conductivity can replace copper and aluminum-based heat transfer products to meet the high heat flux dissipation requirements of highly integrated components inside the payload. Moreover, wi...

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Problems solved by technology

[0005] The present invention aims to solve the problem of low thermal conductivity of the existing organic silica gel adhesive, and provides a variety of carbon materials doped with high thermal conductivity organic silica gel adhesive and its preparation method

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