A rapid prototyping device and method based on ultraviolet exposure dynamic mask technology

Abstract

The invention discloses a rapid prototyping device and method based on the ultraviolet exposure dynamic mask technology. The dynamic mask plate of ultraviolet exposure is used to form an effective and environmentally friendly rapid prototyping new technology. The blocking effect of ozone on ultraviolet rays generates ultraviolet exposure Environmentally friendly masks, applying ozone masks to the field of rapid manufacturing. The method of the present invention can be repeatedly exposed to ultraviolet rays, no harmful gas is generated during the reaction process, it is highly efficient and environmentally friendly, and compared with traditional rapid prototyping machines, it reduces the cost and improves the service life of the equipment, and is suitable for rapid manufacturing and small batches of resin patterns. Rapid trial production of new products and other fields.

Description

technical field [0001] The method relates to the design of a purple light exposure control system, the design of an optical path, the exposure curing of a mould, and a molding process in the field of rapid manufacturing. Background technique [0002] In the process of researching optical manufacturing of complex shapes, how to quickly generate UV-friendly masks of arbitrary shapes has become a problem that has plagued the industry for a long time. However, the service life of the traditional mask is limited by the fogging defect. The fogging defect means that in a specific area, when the electron beam is exposed, some electrons are reflected on the surface of the photoresist, and the electrons reflected from the surface of the photoresist are again When it encounters a baffle placed on the photoresist, it is re-reflected to the photoresist to make it photosensitive. However, due to the atomization defect, the electrons are reflected in the air, so the collision probability i...

AI Technical Summary

Problems solved by technology

However, the service life of the traditional mask is limited by the fogging defect. The fogging defect means that in a specific area, when the electron beam is exposed, some electrons are reflected on the surface of the photoresist, and the electrons reflected from the surface of the photoresist are again When it encounters a baffle placed on the photoresist, it is re-reflected to the photoresist to make it photosensitive. However, due to the atomization defect, the electrons are reflected in the air, so the collision probability is smaller than that in the photoresist. Therefore, in the mask plate, fogging defects are a very important factor, but when the lithography wavelength is greater than 200nm, these defects will not cause too much problem, but when the lithography wavelength is less than 200nm, the affected mask plate will be Up to about 20%, making it difficult to improve the life of the mask

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