Ion palladium activation liquid and preparation method thereof, and plastic surface chemical plating method

A palladium activation and ion technology, which is applied in liquid chemical plating, metal material coating technology, coating, etc., can solve the problems of short service life of activation solution, weak activity of activation solution, poor adhesion, etc., and achieve simple process Effect

Active Publication Date: 2016-04-06
BYD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] The invention solves the technical problems of weak activity, poor adhesion and short service life of the activating solution for plastic electroplating in the prior art, thereby providing an ionic palladium activating solution without overflow plating and its preparation method and A kind of plastic surface electroless plating method

Method used

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preparation example Construction

[0025] The present invention also provides a preparation method for ionic palladium activation solution, the method comprising preparing 1,10-phenanthroline and 4-cyanopyridine solution; dissolving palladium salt and cupric chloride in the chloride complexing agent solution, and then adding 1,10 phenanthroline and 4-cyanopyridine solution to obtain the ionic palladium activation solution. The present invention also provides a method for electroless plating on plastic surfaces, comprising the following steps:

[0026] S1, immersing the workpiece in an ionic palladium activation solution for activation to obtain an activated workpiece;

[0027] S2, immersing the activated workpiece in a reducing agent solution for reduction;

[0028] S3, immersing the reduced workpiece in an electroless plating solution for electroless plating;

[0029] Wherein, the ionic palladium activation solution is the ionic palladium activation solution of the present invention.

[0030] According to t...

Embodiment 1

[0037] 1. Prepare ionic palladium activation solution:

[0038] First dissolve the dissolved 1,10-phenanthroline and 4-cyanopyridine, then dissolve ammonium chloride in water to prepare ammonium chloride aqueous solution, then add palladium chloride and copper chloride step by step to the sodium chloride solution, and stir until completely dissolved, then add dissolved 1,10-phenanthroline and 4-cyanopyridine, and then add sodium hydroxide to adjust its pH to 9 to obtain ionic palladium activation solution A1.

[0039] Each component and its content are: palladium chloride: 0.02g / L, copper chloride: 0.04g / L, ammonium chloride: 1g / L,

[0040] 1,10-phenanthroline: 0.04g / L, 4-cyanopyridine: 0.04g / L.

[0041] 2. Electroless plating

[0042] (1) Substrate pretreatment (ABS): Put ABS into degreasing solution (NaOH1mol / L, NaOH 2 CO 31mol / L, sodium dodecylsulfonate 0.1mol / L), soak for 8 minutes at 50°C, take it out and wash it with tap water.

[0043] (2) Coarse the cleaned ABS (c...

Embodiment 2

[0050] Adopt the step identical with embodiment 1 to prepare plated part B2, difference is: in step 1, ionic palladium activation solution A2: palladium chloride: 0.04g / L, cupric chloride: 0.08g / L, ammonium chloride: 4g / L, 1, 10-phenanthroline: 0.08g / L, 4-cyanopyridine: 0.08g / LpH is 10.

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PUM

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Abstract

The present invention provides an ion palladium activation liquid and a preparation method thereof, and a plastic surface chemical plating method. The ion palladium activation liquid comprises a soluble palladium salt, copper chloride, a chloride complexing agent, 1,10-phenanthroline and 4-cyanopyridine, and the pH value of the ion palladium activation liquid is 6-12. According to the present invention, the service life of the activation liquid is long, the plating time of the material activated with the activation liquid is short, no overflow plating or leakage plating phenomenon is generated, and the adhesion is strong.

Description

technical field [0001] The invention belongs to the field of chemical plating on plastic surfaces, and in particular relates to an ionic palladium activation solution, a preparation method thereof and a method for chemical plating on plastic surfaces. Background technique [0002] Most of the plastic substrates are non-conductors. Before electroplating, a conductive film must be prepared first. The common method is to form the conductive film by electroless plating. Before electroless plating, surface pretreatment must be activated to adsorb a certain amount of activation centers on the substrate, so as to induce subsequent electroless plating. Activation not only determines the quality of the electroless coating, but also determines the quality of the coating. The activation process used in the early days was mostly a two-step method of sensitization and activation. That is, it is first sensitized with stannous chloride, and then activated with silver ammonia solution or ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/30
Inventor 韦家亮
Owner BYD CO LTD
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