Ion palladium activation liquid and preparation method thereof, and plastic surface chemical plating method
A palladium activation and ion technology, which is applied in liquid chemical plating, metal material coating technology, coating, etc., can solve the problems of short service life of activation solution, weak activity of activation solution, poor adhesion, etc., and achieve simple process Effect
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[0025] The present invention also provides a preparation method for ionic palladium activation solution, the method comprising preparing 1,10-phenanthroline and 4-cyanopyridine solution; dissolving palladium salt and cupric chloride in the chloride complexing agent solution, and then adding 1,10 phenanthroline and 4-cyanopyridine solution to obtain the ionic palladium activation solution. The present invention also provides a method for electroless plating on plastic surfaces, comprising the following steps:
[0026] S1, immersing the workpiece in an ionic palladium activation solution for activation to obtain an activated workpiece;
[0027] S2, immersing the activated workpiece in a reducing agent solution for reduction;
[0028] S3, immersing the reduced workpiece in an electroless plating solution for electroless plating;
[0029] Wherein, the ionic palladium activation solution is the ionic palladium activation solution of the present invention.
[0030] According to t...
Embodiment 1
[0037] 1. Prepare ionic palladium activation solution:
[0038] First dissolve the dissolved 1,10-phenanthroline and 4-cyanopyridine, then dissolve ammonium chloride in water to prepare ammonium chloride aqueous solution, then add palladium chloride and copper chloride step by step to the sodium chloride solution, and stir until completely dissolved, then add dissolved 1,10-phenanthroline and 4-cyanopyridine, and then add sodium hydroxide to adjust its pH to 9 to obtain ionic palladium activation solution A1.
[0039] Each component and its content are: palladium chloride: 0.02g / L, copper chloride: 0.04g / L, ammonium chloride: 1g / L,
[0040] 1,10-phenanthroline: 0.04g / L, 4-cyanopyridine: 0.04g / L.
[0041] 2. Electroless plating
[0042] (1) Substrate pretreatment (ABS): Put ABS into degreasing solution (NaOH1mol / L, NaOH 2 CO 31mol / L, sodium dodecylsulfonate 0.1mol / L), soak for 8 minutes at 50°C, take it out and wash it with tap water.
[0043] (2) Coarse the cleaned ABS (c...
Embodiment 2
[0050] Adopt the step identical with embodiment 1 to prepare plated part B2, difference is: in step 1, ionic palladium activation solution A2: palladium chloride: 0.04g / L, cupric chloride: 0.08g / L, ammonium chloride: 4g / L, 1, 10-phenanthroline: 0.08g / L, 4-cyanopyridine: 0.08g / LpH is 10.
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