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Conducting particle and preparation method thereof

A technology of conductive particles and particles, which is applied in the field of electricity, can solve the problems of increased contact resistance, decreased insulation reliability, and poor contact between circuit electrodes, achieving good insulation reliability, good insulation reliability, and avoiding short circuits.

Inactive Publication Date: 2016-04-20
ZHENGZHOU TECHN COLLEGE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In recent years, with the high-definition liquid crystal display, the protrusions of the circuit electrodes of the IC driving the liquid crystal have been narrowed in pitch and narrowed in area, so the following problems have arisen. Particles flow out between adjacent circuit electrodes, causing a short circuit
[0004] In addition, if the conductive particles flow out between the adjacent circuit electrodes, there will be a problem that the conductive particles in the anisotropic conductive adhesive supplemented between the bump and the glass panel will decrease, and the gap between the opposing circuit electrodes will be reduced. The contact resistance increases, causing poor contact
[0005] At the same time, in recent years, although there are technologies to improve the conductivity and reduce the short-circuited conductive particles, after a period of use, the insulation reliability has declined to a large extent.

Method used

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  • Conducting particle and preparation method thereof
  • Conducting particle and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0059] S1: Central insulating particle preparation process: prepare 10 g of central insulating particle 1 composed of a copolymer of divinylbenzene, acrylic acid and acrylonitrile with an adjusted degree of crosslinking, and the surface of the central insulating particle 1 has carboxyl groups. The compressive elastic modulus of the central insulating particle 1 (compressive elastic modulus when the particle diameter is deformed by 20% at 200 degrees Celsius, 20% K value) is 250kgf / mm 2 ;

[0060] S2: Disperse conductive particles 2 in central insulating particles 1: add conductive particles 2 gold to the prepared central insulating particles 1, and put it into a 10% mass concentration polyvinyl alcohol aqueous solution, stir well, and The obtained suspension was polymerized at 100 degrees Celsius for 4 hours to obtain central insulating particles 1 dispersed with conductive particles 2, and the volume ratio of the central insulating particles 1 and conductive particles 2 to go...

Embodiment 2

[0067] In step S5, aluminum oxide is used instead of diamond as the first insulating particles 4, and other steps are the same as in embodiment 1.

Embodiment 3

[0069] In step S2, the volume ratio of the central insulating particles 1 and the conductive particles 2 is adjusted to 10:8, and the rest of the steps are the same as in the first embodiment.

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Abstract

A conducting particle comprises a center insulation particle, conductive microparicles, a nickel layer, a metal coating layer, first insulation particles and second insulation particles. The center insulation particle is made of an organic insulation material. The conductive microparicles are dispersed in the center insulation particle. The center insulation particle is covered with the nickel layer. The nickel layer is covered with the metal coating layer. The first insulation particles are dispersed in the metal coating layer and cover the nickel layer. The second insulation particles are dispersed in the periphery of the metal coating layer. The conducting particle has good conductivity and insulation reliability, and after the conducting particle is used for a period of time, the insulation resistance of all conducting particles is not reduced, and good conductivity is still kept. The conductivity of the conducting particle is not obviously reduced after a moisture absorption experiment.

Description

technical field [0001] The invention relates to the field of electricity, in particular to a conductive particle and a preparation method thereof. Background technique [0002] The conductive particles can be mixed with a binder resin, and used as a so-called circuit connection material for connecting circuit electrodes in electronic products such as semiconductor elements and liquid crystal displays. [0003] In recent years, with the high-definition liquid crystal display, the protrusions of the circuit electrodes of the IC driving the liquid crystal have been narrowed in pitch and narrowed in area, so the following problems have arisen. Particles flow out between adjacent circuit electrodes, causing a short circuit. [0004] In addition, if the conductive particles flow out between the adjacent circuit electrodes, there will be a problem that the conductive particles in the anisotropic conductive adhesive supplemented between the bump and the glass panel will decrease, a...

Claims

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Application Information

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IPC IPC(8): H01B1/22H01B13/00
CPCH01B1/22H01B13/00
Inventor 刘志远潘全喜张丹丹张红涛李勇军
Owner ZHENGZHOU TECHN COLLEGE
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