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Miniature millimeter wave transceiver module

A transceiver component, millimeter wave technology, applied in electrical components, transmission systems, etc., can solve the problems of narrow communication frequency band, large debugging amount, low reliability, etc., to widen the communication frequency band, reduce secondary damage, and reduce link loss. Effect

Active Publication Date: 2016-04-27
NANJING CAIHUA TECH GROUP
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Problems solved by technology

[0003] The purpose of the present invention is to provide a miniaturized millimeter-wave transceiver component. By improving the structure and process, the shortcomings of the existing millimeter-wave transceiver component, such as complex structure, bulky volume, large amount of debugging, low reliability, and narrow communication frequency band, are solved. Provide A miniaturized millimeter-wave transceiver component with excellent performance, which is compact in structure and easy to debug, and can effectively meet the requirements of ultra-wideband and high-speed millimeter-wave communication systems

Method used

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Embodiment Construction

[0025] Below in conjunction with accompanying drawing and embodiment, content of the invention will be further described:

[0026] In the existing technology, this product uses more MMIC chips, and the MMIC chips are all made of 99.6% aluminum oxide substrate material. The expansion coefficient of the substrate material is 7.5. The shielding box selected by the existing millimeter wave transceiver components is basically For copper or aluminum alloy, the expansion coefficient of the profile is about 20, which is quite different from the expansion coefficient of the substrate material, so it is difficult to carry out high-temperature seamless sintering. At the same time, the MMICs of the existing millimeter-wave transceiver components are connected by a microstrip printed board. The microstrip printed board and the MMIC chip are pasted on the shielding box body through conductive silver paste. The conductive silver paste is unevenly coated, and the thickness of the MMIC chip ( ...

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Abstract

The invention provides a miniature millimeter wave transceiver module. By improving the structure and the process, the defects of complex structure, huge volume, large debugging amount, low reliability and narrow communication frequency band of an existing millimeter wave transceiver module are solved, the miniature millimeter wave transceiver module with excellent performance is provided, and the miniature millimeter wave transceiver module is compact in structure, easy to debug, capable of effectively meeting the demands of millimeter wave communication systems with ultra wide bands and high speeds.

Description

technical field [0001] The invention belongs to the technical field of millimeter wave communication, and in particular relates to a miniaturized millimeter wave transceiver component. Background technique [0002] The millimeter-wave wireless transceiver system mainly relies on the millimeter-wave transceiver component to convert high-frequency signals and intermediate-frequency signals, which is an important part of the millimeter-wave communication system. The existing millimeter-wave transceiver components all use conductive silver paste to paste the PCB printed board and MMIC chip on the aluminum shielding box. The MMIC chips are connected by the microstrip line on the PCB printed board, resulting in complex structure and bulky Huge, large amount of debugging, low reliability. At the same time, the waveguide coaxial conversion adopts the microstrip line transition, which is limited by the precision of the processing technology, resulting in a narrow communication frequ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04B1/40
CPCH04B1/40
Inventor 韩琳张君杨广举欧阳建伟马生广
Owner NANJING CAIHUA TECH GROUP
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