Filling method and device of three-dimensional package vertical through hole

Abstract

The invention discloses a filing device of a three-dimensional package vertical through hole. The filling device comprises a metal liquid spraying device and a filling working region and is characterized in that a crucible is of an internally-externally nested circular ring type structure, a cavity between an internal accommodating cavity and an external accommodating cavity is filled with a filling material, a press sheet is driven by a transmission rod connected with piezoelectric ceramic to squeeze a metal liquid in a central hole to be sprayed from a spraying hole, the crucible is connected with the upper part of the cavity by a crucible support connected with a three-dimensional motion controller, so that the crucible moves freely and is matched with a substrate of the filling working region to complete filling. The invention also discloses a method applying the above device for filling the three-dimensional package vertical through hole. With coordination of the metal liquid spraying device and a working platform of the filling working region, uniform liquid drops can be formed, the frequency is controllable, a steady-flow liquid line also can be formed, and metallic filing of the three-dimensional package vertical through hole is achieved. The filling device has the advantages of high size accuracy, low porosity, high filling efficiency, low cost and simplicity in process, and can be automatically produced.

Description

technical field [0001] The invention relates to the technical field of three-dimensional integration of electronic packaging, in particular to a method and device for filling vertical through holes in three-dimensional packaging. Background technique [0002] With the continuous pursuit of high frequency, high speed, multi-function, high performance and small size of electronic devices, electronic packaging technology is required to achieve higher integration density and smaller package size. For this reason, the package interconnection structure gradually changes from two-dimensional to three-dimensional. develop. One of the core technologies of three-dimensional packaging is Through Silicon Via (TSV) technology, which realizes three-dimensional vertical interconnection between chips or between chips and substrates by forming through holes in the semiconductor substrate that penetrate the upper and lower surfaces and are metallized. To make up for the limitation of two-dim...

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Problems solved by technology

The advantage of electroplating hole filling mainly based on electroplating copper is that copper has good conductivity, but the disadvantage is that electroplating requires a good seed layer, long electroplating time and complicated process, and it is difficult to achieve holes with a diameter of less than 5 microns for electroplating filling; the main material is tungsten The chemical vapor deposition of chemical vapor deposition can realize the filling of small pores, but the disadvantages are complex process, long time and high cost; conductive adhesive can simplify the filling process, but the conductivity and thermal stability are very poor, and it is difficult to fill micropores; intermetallic compounds are used Filling is formed by the method of brazing reaction between low-melting-point solder and high-melting-point metal layer. The advantage is to reduce the complexity of the process and the production cost, but the disadvantage is that the required brazing reaction time is long, the production efficiency is low, and the intermetallic compound formed Voids are generated due to volume shrinkage, and it is easy to react with the residual metal layer to form holes in the subsequent service process, which brings uncertain reliability problems; the method of filling the through holes with molten low-melting solder by capillary action is fast , the advantage of low cost, the disadvantage is that it is easy to form voids or underfilling, and it is difficult to fill micropores with large aspect ratio

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