High power density COB (Chip On Board) packaged white LED (Light Emitting Diode) module and packaging method thereof

A high power density, LED module technology, applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problems of LED luminous efficiency reduction, life and reliability discount, quality problems, etc., achieve rapid heat conduction and heat dissipation area, solve heat dissipation Problems, the effect of saving solder paste

Inactive Publication Date: 2016-05-25
TIANJIN UNIV
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Problems solved by technology

If the heat emitted by the chip is not exported and dissipated in time, a large amount of heat will accumulate inside the LED, which will cause the temperature rise effect of the chip, the luminous

Method used

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  • High power density COB (Chip On Board) packaged white LED (Light Emitting Diode) module and packaging method thereof
  • High power density COB (Chip On Board) packaged white LED (Light Emitting Diode) module and packaging method thereof
  • High power density COB (Chip On Board) packaged white LED (Light Emitting Diode) module and packaging method thereof

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[0031] The present invention will be further described in detail below in conjunction with the drawings:

[0032] A multi-chip integrated high-power LED module packaged with nano silver solder paste, which includes ( Figure 5 )Al 2 O 3 The ceramic substrate 1, the nano silver solder paste 2, the LED chip 3, and the gold wire 4 bonded on the light emitting diode chip are connected to the input electrode and output electrode of the power supply. The light emitting diode chip and the bonding alloy wire array are in the central fence 5 of the substrate , The method of the present invention is realized through the following technical solutions.

[0033] Using nano silver solder paste as the middle layer, the five steps of dispensing, patching, sintering, gold wire connection, and potting silica gel are used to realize the encapsulation of COB high-power white light LED module:

[0034] (1) Spot the nano silver solder paste 2 on Al with a dispenser 2 O 3 On the ceramic substrate 1, the di...

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Abstract

The invention relates to a high power density COB (Chip On Board) packaged white LED (Light Emitting Diode) module and a packaging method thereof. A ceramic substrate is provided with a circuit layer and a box dam which is used for fixing packaging glue onto the substrate, and a packaging unit matrix for packaging LED chips is arranged on the circuit layer; the LED chips are arranged on the matrix; the LED chips are stuck to the substrate via nano-silver paste; and gold threads bonded to the chips are connected with an input electrode and an output electrode of a power supply. By adopting the single high power density LED chip and multi-chip integrated LED packaging method, the white LED module is high in light output, small in size and good in heat dissipation; and the high power COB module is used with accessories such as a shell, a base, a precision machining radiator, a high-grade reflector, a heat conducting plate, a support and the like to provide a 25W high power COB light source with high photoelectric conversion rate, long service life, energy conservation and environment friendliness.

Description

technical field [0001] The invention relates to a high power density COB packaged white light LED module and a preparation method thereof. It provides a 25W high-power white light COB module with high light output and small volume, and adopts nano-silver solder paste with high thermal conductivity and electrical conductivity to match and sinter it. The LED module can greatly enhance the heat dissipation of the module and reduce the junction temperature, thereby improving its luminous efficiency and greatly improving its lifespan, energy saving and environmental protection. Background technique [0002] As a new type of solid-state lighting with great potential, light-emitting diode (LED) has the advantages of green, environmental protection, short response time, long life, low power consumption, high luminous efficiency, and good stability. High-power LED solid-state lighting is the most important lighting revolution since the invention of the incandescent lamp. With the co...

Claims

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Application Information

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IPC IPC(8): H01L25/075H01L33/48H01L33/62H01L33/64H01L33/56
CPCH01L2224/48091H01L2924/00014H01L25/0753H01L33/486H01L33/56H01L33/62H01L33/641H01L33/647
Inventor 陈佳李欣陆国权梅云辉
Owner TIANJIN UNIV
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