In-situ visualization method for cavitation behavior of fused brazing filler metal in solid liquid interface in ultrasonic-assisted brazing
A technology of solid-liquid interface and molten solder, applied in welding equipment, metal processing equipment, manufacturing tools, etc., to achieve the effect of optimizing technology and application
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Embodiment 1
[0052] Using the above-mentioned synchrotron radiation imaging method and device, Al-11.5Si-1.5Mg solder alloy (melting point 585°C) was selected to make an ultra-thin sample of 200 μm by sandpaper grinding, and TC4 titanium alloy was selected as the base material, and the test temperature was set At 610°C, observe the generation and distribution of bubbles at the solid-liquid interface during the heating process and after ultrasonic application. Among them, a) there are no bubbles at 0°C, and there are gaps at the interface; b) bubbles appear at 610°C when ultrasonic is applied for 10s; c) bubbles become larger and gaps decrease at 620°C when ultrasonic is applied for 60s. Such as Figure 4 Shown:
Embodiment 2
[0054] Using the above-mentioned synchrotron radiation imaging method and device, select Al-11.5Si-1.5Mg solder alloy (melting point 585°C), grind it with sandpaper to make an ultra-thin sample of 200 μm, select 1060 aluminum alloy as the base material, and set the test temperature At 600°C, observe the generation and distribution of bubbles at the solid-liquid interface during the heating process and after ultrasonic application. Among them, a) there are no bubbles at 0°C, and there are gaps at the interface; b) bubbles appear at 600°C when ultrasonic is applied for 10s; c) bubbles become larger when ultrasonic is applied for 50s at 610°C. Such as Figure 5 shown.
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