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Precise laser cutting system

A laser cutting and cutting system technology, applied in laser welding equipment, welding equipment, metal processing equipment, etc., can solve the problems of material surface shape and height instability, low precision, difficult detection and control, etc., to ensure laser processing Effect, stable processing quality, best processing efficiency

Active Publication Date: 2016-06-08
HANS LASER TECH IND GRP CO LTD
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

However, the use of the capacitor height controller can only work when cutting metal. When the capacitor height controller is cutting non-metal, because the capacitance formed is very small, it is difficult to detect and control, so the capacitor height controller cannot be used for non-metallic materials.
[0005] There is also a basic optical method to detect the relative height of the focusing lens relative to the surface of the material to be cut, but because it uses the detection laser cutting beam to act on the relative height of the focusing lens at the position of the material, and during the laser cutting process, the laser cutting beam acts on the position of the material In a small range at and near it (generally it can be considered that the diameter range of about 2 laser focus spots, and the circle range with a diameter of about 0.2mm), there will be intense interaction between the laser and the material. When the laser cutting beam acts on the material The substances at and near the position will melt, soften, form molten pools, deform and other complex reactions during the interaction process. In this process, the laser cutting beam acts on a small range at and near the material position Internally, the surface shape and height of the material are very unstable, even in a chaotic dynamic change process, which brings errors to the optical detection, resulting in unstable measurement and low precision

Method used

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Embodiment Construction

[0036] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0037] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention.

[0038] refer to figure 1 As shown, a precision laser cutting system provided by the...

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Abstract

The invention relates to the technical field of precise laser cutting and discloses a precise laser cutting system. The precise laser cutting system comprises a laser source assembly, an optical module, a three-dimensional movement assembly and a computer. The three-dimensional movement assembly comprises an x-axis and y-axis movement platform and a z-axis movement platform. The x-axis and y-axis movement platform is used for driving a material to be machined to move in the x direction and the y direction. The z-axis movement platform is used for driving the optical module to move in the z direction. The laser source assembly emits a machining laser beam. The machining laser beam is focused on the material to be machined under the action of the optical module so as to machine the material to be machined. The computer is connected with the laser source assembly, the optical module, the x-axis and y-axis movement platform and the z-axis movement platform. According to the precise laser cutting system, the image of the surface of the material to be machined can be observed and detected, and the focal point of the machining laser beam can be adjusted automatically.

Description

technical field [0001] The present invention relates to the technical field of precision laser cutting, and more specifically relates to a precision laser cutting system. Background technique [0002] Due to its advantages of high brightness, high directivity, high monochromaticity and high coherence, laser has been widely used in scientific research, national defense, industry and other important aspects of national production. In the industrial field, laser processing, as an advanced manufacturing technology, has the advantages of high efficiency, high precision, high quality, wide range, energy saving and environmental protection, and can realize flexible processing and ultra-fine processing. It is used in automobiles, electronic circuits, electrical appliances, aerospace, iron and steel metallurgy , machinery manufacturing and other fields have been widely used, and have reached a higher level in some industries (such as automobiles, electronics industries, etc.). It pl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/38B23K26/08B23K26/064B23K26/14B23K26/046
Inventor 赵建涛肖磊杨锦彬宁艳华高云峰
Owner HANS LASER TECH IND GRP CO LTD
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