Food processing method mainly for cashew nuts
A technology of food processing and cashew nuts, which is applied in the field of food processing with cashew nuts as the core, can solve the problems of low added value, easy to get angry, unsuitable, etc., and achieve the effect of short time consumption, high processing efficiency and balanced nutrition
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Embodiment 1
[0019] The food processing method with cashew nuts as the core of the present invention comprises the following steps: (1) after steaming and drying the raw cashew nuts with husks in sequence, removing the husks, then baking, humidifying and undressing to obtain cashew nuts (2) making the dough; (3) wrapping the cashew nuts, placing the cashew nuts on the dough, curling the edges of the dough to form an open container with a cavity and an opening, and the volume of the cashew nuts is smaller than the volume of the inner cavity of the dough; (4) Inject jam, inject jam from the opening of the dough, and the jam fills the gap between the inner wall of the dough cavity and the cashew kernel; (5) Seal and throw the dough into a circle, after closing the opening of the dough, send it to the rounding machine for rounding; (6) Vacuum Frying, under the conditions of oil temperature 100°C and vacuum degree 0.05MPa, send the rounded material into a closed container for frying for 5-10 min...
Embodiment 2-6
[0030] In embodiment 2-6, each step is basically the same as embodiment 1, and the parameters of frying step and deoiling step are with reference to table 1:
[0031]
Example 2 Example 3 Example 4 Example 5 Example 6 Fried Vacuum 0.65MPa 0.08MPa 0.06MPa 0.07MPa 0.05MPa frying temperature 102℃ 105℃ 103℃ 104℃ 101℃ frying time 6min 8min 9min 10min 7min Deoiling vacuum 0.08MPa 0.08MPa 0.06MPa 0.07MPa 0.05MPa
[0032] Table 1
[0033] In embodiment 2-6, the distribution ratio of dough ingredients is with reference to Table 2:
[0034]
Example 2 Example 3 Example 4 Example 5 Example 6 High-gluten flour 55% 57% 58% 59% 60% Dendrobium officinale powder 8% 7% 6% 5% 8% white sugar 5% 3% 3% 3% 4% Compound Baking Powder 0.35% 0.5% 0.45% 0.3% 0.5%
[0035] Table 2
[0036] See the following table 3 for the distribution ratio of wafer shell ingre...
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Abstract
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