Heat dissipation coating and preparation method thereof

Abstract

The invention relates to a heat dissipation coating and a preparing method thereof and belongs to the technical field of coatings. The heat dissipation coating is mainly prepared from, by mass, 15-25% of organic silicon resin, 5-15% of boron nitride, 5-18% of silicon dioxide, 3-8% of bentonite, 0-1.5% of dispersing agent, 0-1.5% of flatting agent, 0-1.5% of anti-settling agent, 0-1.5% of adhesion promoter, and the balance solvent. A heat dissipation coating layer is formed after a heat dissipation element is coated with the heat dissipation coating, the heat dissipation coating layer can conduct heat in the element to the coating layer in a heat conduction mode, and heat is quickly dissipated through the character that the material of the coating layer dissipates heat quickly. Meanwhile, the coating has the advantages that self-drying and normal temperature solidifying are achieved, construction is easy and convenient, and cost is saved. The finally obtained heat dissipation layer can resist a certain degree of high temperature and corrosion, and very good application prospects can be achieved.

Description

technical field [0001] The invention relates to the technical field of coatings, in particular to a heat-dissipating coating and a preparation method thereof. Background technique [0002] The heat dissipation problem of electronic equipment is related to the reliability and life of electronic equipment. It is a bottleneck affecting the development of today's electronics industry. With the three major development trends of high performance, miniaturization and integration in the electronics industry, the heat dissipation problem is becoming more and more prominent. . In addition, heat dissipation is also one of the main factors that limit the power increase of light-emitting diodes (LEDs), especially in some special and harsh environments, such as the heat dissipation problem of high-power LED lamps used in underwater closed environments is particularly prominent. Research on high-power LED lamps Finding a better way to dissipate heat is an urgent problem to be solved. [...

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Problems solved by technology

[0004] However, at present, the air-cooling method is usually adopted in the heat dissipation of electronic products, especially the CPU. This method belongs to heat convection, and the cooling efficiency is low, and the fan also produces noise, and also has the defect of being easily damaged; This method belongs to heat conduction, but it also has disadvantages such as low cooling efficiency, immature technology and high price; there is also the use of heat-conducting silica gel for heat dissipation, but the effect is not ideal

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