Heat dissipation coating and preparation method thereof
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A technology for heat-dissipating coatings and raw materials, applied in anti-corrosion coatings, fire-retardant coatings, coatings, etc., can solve the problems of low refrigeration efficiency, immature technology, and easy damage, and achieve the effects of simple and convenient construction, good heat dissipation effect, and simple operation.
Inactive Publication Date: 2018-04-24
GUANGDONG TESTING INST OF PROD QUALITY SUPERVISION
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[0004] However, at present, the air-cooling method is usually adopted in the heat dissipation of electronic products, especially the CPU. This method belongs to heat convection, and the cooling efficiency is low, and the fan also produces noise, and also has the defect of being easily damaged; This method belongs to heat conduction, but it also has disadvantages such as low cooling efficiency, immature technology and high price; there is also the use of heat-conducting silica gel for heat dissipation, but the effect is not ideal
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Embodiment 1
[0035] A heat-dissipating coating made from the following raw materials in mass fraction:
[0036]
[0037] The preparation method of above-mentioned heat-dissipating coating is as follows:
[0038] Dissolve the above-mentioned silicone resin in the above-mentioned solvent, then add boron nitride, silicon dioxide, dispersant, leveling agent, and adhesion promoter, mix thoroughly, then add bentonite, and stir evenly to obtain heat-dissipating coating A.
Embodiment 2
[0040] A heat-dissipating coating made from the following raw materials in mass fraction:
[0041]
[0042] The preparation method of above-mentioned heat-dissipating coating is as follows:
[0043] Dissolve the above-mentioned silicone resin in the above-mentioned solvent, then add boron nitride, silicon dioxide, dispersant, leveling agent, and adhesion promoter, mix thoroughly, then add bentonite, and stir evenly to obtain heat-dissipating coating B.
Embodiment 3
[0045] A heat-dissipating coating made from the following raw materials in mass fraction:
[0046]
[0047] The preparation method of above-mentioned heat-dissipating coating is as follows:
[0048] Dissolve the above-mentioned silicone resin in the above-mentioned solvent, then add boron nitride and silicon dioxide, mix thoroughly, then add bentonite, and stir evenly to obtain heat-dissipating coating C.
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Abstract
The invention relates to a heat dissipation coating and a preparing method thereof and belongs to the technical field of coatings. The heat dissipation coating is mainly prepared from, by mass, 15-25% of organic silicon resin, 5-15% of boron nitride, 5-18% of silicon dioxide, 3-8% of bentonite, 0-1.5% of dispersing agent, 0-1.5% of flatting agent, 0-1.5% of anti-settling agent, 0-1.5% of adhesion promoter, and the balance solvent. A heat dissipation coating layer is formed after a heat dissipation element is coated with the heat dissipation coating, the heat dissipation coating layer can conduct heat in the element to the coating layer in a heat conduction mode, and heat is quickly dissipated through the character that the material of the coating layer dissipates heat quickly. Meanwhile, the coating has the advantages that self-drying and normal temperature solidifying are achieved, construction is easy and convenient, and cost is saved. The finally obtained heat dissipation layer can resist a certain degree of high temperature and corrosion, and very good application prospects can be achieved.
Description
technical field [0001] The invention relates to the technical field of coatings, in particular to a heat-dissipating coating and a preparation method thereof. Background technique [0002] The heat dissipation problem of electronic equipment is related to the reliability and life of electronic equipment. It is a bottleneck affecting the development of today's electronics industry. With the three major development trends of high performance, miniaturization and integration in the electronics industry, the heat dissipation problem is becoming more and more prominent. . In addition, heat dissipation is also one of the main factors that limit the power increase of light-emitting diodes (LEDs), especially in some special and harsh environments, such as the heat dissipation problem of high-power LED lamps used in underwater closed environments is particularly prominent. Research on high-power LED lamps Finding a better way to dissipate heat is an urgent problem to be solved. [...
Claims
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Application Information
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