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Phenolic resin adhesive containing demethylated lignin and preparation method of phenolic resin adhesive

A phenolic resin glue and demethylation technology, which is applied in the field of materials, can solve the problems of high free phenol content and high cost, and achieve the effects of reducing free phenol content, improving reactivity, and efficiently utilizing the pressure of petroleum resources

Active Publication Date: 2016-07-13
CHANGZHOU UNIV
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  • Abstract
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  • Application Information

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Problems solved by technology

[0004] In order to solve the problems that the free phenol content in the existing phenolic resin system is relatively high, the raw material is derived from petroleum cracking products, and the cost is relatively high, the present invention provides a demethylated lignin-containing phenolic resin adhesive and a preparation method thereof

Method used

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  • Phenolic resin adhesive containing demethylated lignin and preparation method of phenolic resin adhesive
  • Phenolic resin adhesive containing demethylated lignin and preparation method of phenolic resin adhesive
  • Phenolic resin adhesive containing demethylated lignin and preparation method of phenolic resin adhesive

Examples

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Embodiment 1

[0017] Using in-situ generated Lewis acid as a modifier, wheatgrass alkali lignin:N,N-dimethylformamide is 1:19.0(w / w), wheatgrass alkali lignin:iodocyclohexane is 1:12( mol / mol). Dissolve wheatgrass alkali lignin in dimethylformamide, stir to disperse the system evenly, slowly add iodocyclohexane dropwise, raise the temperature to 145°C while stirring, and react under nitrogen protection for 7h. The demethylated lignin is obtained after rotary evaporation, centrifugation, washing and drying. The substitution rate of above-mentioned demethylated lignin to phenol is 30%, the consumption of sodium hydroxide is 4% of total solution quality, the mol ratio of phenol and formaldehyde is 1:2 (mol / mol), the ratio of phenol and water The molar ratio is 0.15:1 (mol / mol), and the molar ratio of phenol to demethylated lignin is 97.2:1 (mol / mol). Add phenol, sodium hydroxide, water and formaldehyde solution to a 100mL three-necked flask , heated to 60°C, stirred to disperse the system ev...

Embodiment 2

[0019] On the basis of Example 1, the substitution rate of demethylated lignin to phenol is 70%, the consumption of sodium hydroxide is 4% of the total solution quality, and the molar ratio of phenol and formaldehyde is 1:2 (mol / mol), the molar ratio of phenol and water is 0.1:1 (mol / mol), the molar ratio of phenol and demethylated lignin is 17.9:1 (mol / mol), the phenol, sodium hydroxide, water and formaldehyde Add the solution into a 100mL three-necked flask, heat to 60°C, stir to disperse the system evenly, then raise the temperature to 90°C, keep the temperature for 1.5h, then add demethylated lignin, continue to keep the heat for 2h, cool out The material was used to obtain a demethylated lignin-containing phenolic resin adhesive (D-LPF2).

Embodiment 3

[0021] On the basis of Example 1, the substitution rate of demethylated lignin to phenol is 60%, the consumption of sodium hydroxide is 3.5% of the total solution quality, and the molar ratio of phenol to formaldehyde is 1:2 (mol / mol), the molar ratio of phenol and water is 0.15:1 (mol / mol), the molar ratio of phenol and demethylated lignin is 27.8:1 (mol / mol), the phenol, sodium hydroxide, water and formaldehyde Add the solution into a 100mL three-necked flask, heat to 60°C, stir to disperse the system evenly, then raise the temperature to 90°C, keep the temperature for 1.5h, then add demethylated lignin, continue to keep the heat for 2h, cool out The material was used to obtain a demethylated lignin-containing phenolic resin adhesive (D-LPF3).

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Abstract

The invention discloses phenolic resin adhesive containing demethylated lignin and a preparation method of the phenolic resin adhesive and belongs to the technical field of materials. Phenol, sodium hydroxide, water and a formaldehyde solution are added to a container, heated to 60 DEG C, stirred until the system is uniformly dispersed and then heated to 90 DEG C, a reaction is performed in a thermal-insulation state for 1.5 h, demethylated lignin is added, the mixture is continuously subjected to the reaction in the thermal-insulation state for 2 h, cooled and discharged, and the phenolic resin adhesive containing demethylated lignin is obtained. By comparison with unmodified lignin-based phenolic resin adhesives, the free formaldehyde content is reduced from 0.65% to 0.22%, the free phenol content is reduced from 1.37% to 0.82%, and the adhesion strength is increased from 0.97 MPa to 2.11 MPa. Besides, the demethylated lignin modified phenolic resin adhesive provides guarantee for sustainable development of phenolic resin glue by taking renewable lignin as a main substitute of petroleum-based phenol.

Description

technical field [0001] The invention relates to a demethylated lignin-containing phenolic resin adhesive and a preparation method thereof, belonging to the field of material technology. Background technique [0002] Traditional phenolic resin (PF) is synthesized from phenol and formaldehyde under alkaline or acidic conditions. Phenolic resin (PF) is often the preferred adhesive for the production of heat-resistant and weather-resistant wood products due to its high bond strength, water resistance and good chemical stability. However, there are deficiencies in PF. On the one hand, traditional PF has disadvantages such as high production cost, high hot-pressing temperature, long hot-pressing time, high content of free phenol, and easy cracking on the surface, resulting in low production efficiency and high energy and equipment consumption. Limit the wider application of phenolic resin adhesives. On the other hand, the raw materials of PF adhesives mainly come from non-renewa...

Claims

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Application Information

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IPC IPC(8): C09J161/14C08G8/28C08H7/00
CPCC08G8/28C08H6/00C09J161/14
Inventor 宋艳王志新王楠李锦春
Owner CHANGZHOU UNIV
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