Manufacturing method of thin-walled large-scale honeycomb ceramic carrier mold that can be repeatedly coated

Abstract

The invention relates to a manufacturing method for a thin-wall large-specification honeycomb ceramic carrier die capable of being repeatedly coated. The carrier die comprises a main die. The main die is provided with a plurality of feeding holes and discharging grooves corresponding to the feeding holes. The manufacturing method comprises the steps that a die plate blank is manufactured through die steel or other alloy steel; a feeding hole drilling machining program is compiled, and drilling is conducted through a numerical control deep hole drill; a linear cutting machining program is compiled, and the discharging grooves are machined on a linear cutting machine tool; pre-extrusion is conducted on an extrusion machine, and the inner surfaces of the feeding holes and the inner surfaces of the discharging grooves are ground to remove burrs and to be polished; the surfaces of the feeding holes of the carrier die and the surfaces of the discharging grooves of the carrier die are subjected to first-time coating machining; first-time batched honeycomb ceramic production is conducted through the coated carrier die, and after a certain number of ceramic blanks are extruded and formed, the feeding holes and the discharging grooves of the carrier die are subjected to second-time surface coating machining; and the carrier die subjected to second-time coating is utilized for conducting second-time batched production, and coating machining is conducted again after production.

Description

Technical field [0001] The invention relates to the technical field of manufacturing honeycomb ceramic molds, in particular to a method for manufacturing a thin-walled large-size honeycomb ceramic carrier. Background technique [0002] The known honeycomb pottery molds are composed of a large number of feed holes and a discharge trough that penetrates them. [0003] The width of the groove width of the thin-walled large-size mold is easy to widen due to the abrasion of the mud in the groove during use. When the groove width exceeds the specified value, the wall thickness of the extruded large-size carrier exceeds the upper limit of the standard value. That is, it is scrapped; and the hardness of the slime extruded by the thin-walled large carrier is harder than the ordinary large carrier, and the moisture is lower, so as to ensure that the slime when the thin-walled large carrier is extruded has better shape retention and avoid The defects such as the overall deformation of the bl...

AI Technical Summary

Problems solved by technology

If the drilling depth is too deep, the length of the drill bit must be extended, the bit rigidity is poor, and the bit is easy to break during drilling

In addition, if the hole depth is too deep, the chip removal is not smooth during drilling, and the drill bit is easy to break when drilling

This kind of small deep hole is also a blind hole. If the drill bit is broken, the drill bit cannot be taken out and the mold will be scrapped

[0006] At the same time, since the feed hole is a small and deep blind hole, the hole cannot be finished by reaming

Therefore, the roughness of the inner wall of the hole processed by this drilling method is very poor, only Ra12.5-6.3

And because of the vertical processing, the chip must be removed by pecking, and the tool is fed multiple times and retracted to the surface of the template to remove the chip, so the drilling efficiency is low

[0007] The combination of two templates inevitably has positioning deviation and increases extrusion resistance

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