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Chemical copper plating agent and preparation method thereof

A technology of electroless copper plating and copper sulfate, which is applied in the direction of liquid chemical plating, metal material coating process, coating, etc., and can solve problems such as non-compliance, physical injury of employees, and high toxicity

Active Publication Date: 2016-07-20
JIANGSU AISEN SEMICON MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The copper metallization of LDS lines currently used in the market is mostly CuCl 2 System-based; most stabilizers are free CN - Mainly (free CN - highly toxic), does not meet the requirements of the European Directive on the Restriction of the Use of Certain Hazardous Components in Electrical and Electronic Equipment (RoHS for short)
Moreover, the potion contains a large amount of Cl - It will cause the reducing agent formaldehyde to volatilize in a large amount during production, which will cause physical harm to employees; it will also cause difficulties in wastewater treatment

Method used

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  • Chemical copper plating agent and preparation method thereof
  • Chemical copper plating agent and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] ① Add 30% deionized water to the container;

[0019] ② When stirring, add 0.04% EDTA-2Na (disodium ethylenediaminetetraacetic acid) according to the proportion, and stir for 25-30 minutes;

[0020] ③ While stirring, add 0.007% copper sulfate according to the ratio, and continue stirring for 25-30 minutes;

[0021] ④ When stirring, add 0.007% sodium hydroxide according to the proportion, and continue stirring for 25-30 minutes;

[0022] ⑤ When stirring, add 0.005% EDTP (tetrahydroxypropylethylenediamine) according to the proportion, and continue stirring for 25-30 minutes;

[0023] ⑥ When stirring, add 0.004% formaldehyde, 0.005% methanol, 0.05% adipic acid and 0.01% succinic acid according to the proportion, and continue stirring for 25-30 minutes;

[0024] ⑦Add water to the required amount, and stir well after completion.

Embodiment 2-5

[0026] Repeat the method of Experimental Example 1 by the content of each component specified in Table 1 to obtain chemical copper plating agents of different proportions (omitting deionized water), and the obtained chemical copper plating agents are tested according to RoHS requirements.

[0027] Table 1:

[0028]

[0029]

[0030] The whole product to be plated is immersed in the middle of the electroless copper plating agent that embodiment 1-5 makes 30min, takes out and dries, and adopts CuCl 2 The system copper plating agent was used as a control example for testing.

[0031] The detection method is:

[0032] ①Adhesion test: Repeat the 3M tensile test of Baige 3 times to observe whether the coating has fallen off;

[0033] ②Double 85 test: place it in an environment with a temperature of 85°C and a humidity of 85%, and observe when the coating changes.

[0034] Table 2:

[0035]

[0036] As can be seen from Table 2, compared to CuCl 2 System copper pl...

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Abstract

The invention belongs to the technical field of circuit board manufacturing and relates to a chemical copper plating agent and a preparation method thereof. The chemical copper plating agent is composed of, by weight percentage, 0.03-0.04% of EDTA-2Na, 0.005-0.007% of copper sulfate, 0.003-0.007% of sodium hydroxide, 0.002-0.005% of EDTP, 0.002-0.004% of formaldehyde, 0.003-0.005% of methyl alcohol, 0.01-0.05% of adipic acid, 0.005-0.01% of succinic acid, and the balance deionized water. The chemical copper plating agent not only can meet the RoHS standard, but also has higher adhesive force and heat-wet resistance compared with CuCl2 system copper plating agents.

Description

technical field [0001] The invention relates to the technical field of circuit board manufacturing, in particular to an electroless copper plating agent with non-toxic coating and good coating performance and a preparation method thereof. Background technique [0002] 3D-MID is the abbreviation of "Three-dimensionalMoldedInterconnectDevice" in English. It is literally translated into three-dimensional molded interconnect device in Chinese. It mainly refers to the production of three-dimensional circuits with electrical functions on the surface of injection-molded plastic shells. . There are many kinds of 3D-MID technologies, including LDS (Laser Direct Structuring), LRP (Laser Reconstruction Printing), etc. Among them, LDS technology has been widely used in communication, automotive electronics, electromechanical equipment, medical equipment and other applications. [0003] The copper metallization of LDS lines currently used in the market is mostly CuCl 2 System-based; mo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/40
CPCC23C18/405
Inventor 卢瑞华
Owner JIANGSU AISEN SEMICON MATERIAL CO LTD
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