Tungsten-copper composite material and preparation method thereof
A composite material, tungsten copper technology, applied in the direction of chemical instruments and methods, layered products, metal layered products, etc., can solve the problems of low yield, easy delamination, low bonding strength of material interface, etc., and achieve high yield , good uniformity, uniform thickness of copper layer
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Embodiment 1
[0028] Firstly, two tungsten plates with a porosity of 25%, external dimensions of 60×200mm, and a thickness of 2.4mm are selected as the substrate, and copper rods of Φ3×200mm are respectively placed on the upper and lower sides of the tungsten plate and fastened with Φ1mm copper wires, and then put into the In the furnace, keep the temperature at 1250°C under a hydrogen atmosphere for 1.5 hours; secondly, polish and polish the two tungsten plates impregnated with copper, then immerse them in 40% (volume ratio) hydrochloric acid for 30 seconds, take them out, rinse them with clean water, and dry them , use the method of ion copper plating to plate a layer of copper with a thickness of 0.1 μm; then use a pulse power supply to simultaneously perform electrodeposited copper on two tungsten copper plates at different positions in a rotating device with a depth of 350mm (the distance from the liquid surface to the bottom). That is, it is carried out in an acidic copper sulfate solu...
Embodiment 2
[0031] Firstly, two tungsten plates with a porosity of 10%, an external dimension of 60×200mm, and a thickness of 4.8mm are selected as the substrate, and copper foils with the same external dimensions as the tungsten plate and a thickness of 0.2mm are respectively placed on the upper and lower sides of the tungsten plate. After fastening the Φ1mm copper wire, put it into the furnace, and keep the temperature at 1150°C for 0.5h in a hydrogen atmosphere; secondly, polish and polish the two tungsten plates impregnated with copper, and then immerse them in 20% (volume ratio) hydrochloric acid for 60 seconds , take it out, rinse it with clean water, dry it, and use the method of ion copper plating to plate a layer of copper with a thickness of 3 μm; Electrodeposition copper cladding on tungsten copper plate is carried out in self-circulation of acidic copper sulfate solution at room temperature, CuSO 4 ·H 2 O: 190g / L, H 2 SO 4 : 52g / L, the speed of rotation and revolution is 20...
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