Colorless transparent high-performance low-surface-roughness polyimide optical thin film material and preparation method thereof
A polyimide and optical film technology, applied in the field of materials, can solve the problems that the surface flatness of the film cannot meet the requirements of the optical film and the surface roughness cannot reach the nanometer level, etc., and achieves low thermal expansion coefficient, low surface roughness, The effect of high heat resistance
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Embodiment 1
[0022] Put nitrogen into a 500ml three-neck flask equipped with a stirrer, add 0.06mol of 2,2'-TFDB, dissolve in 280ml of N,N-dimethylacetamide, then add 0.06molsBPDA, and keep the temperature at 25°C for polycondensation reaction After 10 hours, a polyamic acid solution with a solid content of 12% was obtained, and the obtained polyamic acid glue was vacuum removed to remove air bubbles, and 0.2 g of leveling agent polydimethylsiloxane was added; then, a certain thickness was applied on a glass plate with a spatula Finally, bake the film at 80°C for 2h, 120°C for 2h, 180°C for 1h, 250°C for 1h, and 300°C for 1h in a blast oven to obtain a film with a thickness of 50μm. The prepared film was tested with an interferometer, and the results were as follows: figure 1 shown.
Embodiment 2
[0024] Introduce nitrogen gas into a 500ml three-necked flask equipped with a stirrer, add 0.06mol of 3,3'-TFDB, dissolve it in 200ml of N,N-dimethylformamide, then add 0.0612mol of α-BPDA, and maintain the temperature at 25 ℃, reacted for 24 hours, and obtained a polyamic acid solution with a solid content of 15%. Vacuum the obtained polyamic acid glue to remove air bubbles, add 5 grams of leveling agent isophorone, and stir; then use a spatula to coat a certain amount of Finally, bake the film in a blast oven at 80°C for 2 hours, at 120°C for 2 hours, at 180°C for 1 hour, at 250°C for 1 hour, and at 300°C for 1 hour, and remove the film to obtain a film with a thickness of 75 μm. Thin film material interferometer test result graph and figure 1 resemblance.
Embodiment 3
[0026] Pass nitrogen into a 500ml three-necked flask equipped with a stirrer, add 0.06mol of 3-BDAF, dissolve it in 230ml of N-methylpyrrolidone, then add 0.061mol of 6FDA, keep the temperature at 35°C, and react for 10h to obtain 20% solid content Polyamic acid solution; vacuum the obtained polyamic acid glue to remove bubbles, add 10 grams of leveling agent fluorocarbon; then use a scraper to coat a certain thickness of film on a glass plate, and then dry it in a blast oven at 80°C Bake for 2 hours, bake at 120°C for 2 hours, bake at 180°C for 1 hour, bake at 250°C for 1 hour, bake at 300°C for 1 hour, and remove the film to obtain a film with a thickness of 25 μm. Thin film material interferometer test result graph and figure 1 resemblance.
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