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Chemical nickel-phosphorus-plated alloy solution and method for applying the same to printed wiring board to deposit nickel-phosphorus alloy

A technology of electroless nickel-phosphorus and alloy solution, which is applied in the direction of liquid chemical plating, printed circuit, printed circuit manufacturing, etc. It can solve the problems of false plating weldability, deterioration, and reduce the self-catalytic activity of metal nickel, so as to reduce false plating. Plating, to ensure the effect of welding

Inactive Publication Date: 2016-08-03
GUANGDONG LEAR ELECTROCHEM LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Excessively high stabilizer or sulfide content will reduce the autocatalytic activity of metallic nickel, resulting in false plating or plating with high phosphorus content but poor weldability

Method used

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  • Chemical nickel-phosphorus-plated alloy solution and method for applying the same to printed wiring board to deposit nickel-phosphorus alloy

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Experimental program
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Embodiment Construction

[0030] The present invention relates to a kind of electroless nickel phosphorus alloy plating solution, comprises the component of following mass concentration:

[0031] Nickel sulfate or soluble nickel salt 10-50g / L

[0032] Sodium hypophosphite 10-50g / L

[0033] Complexing agent 10-40g / L

[0034] Buffer 10-40g / L

[0035] Stabilizer 0.05-1000mg / L

[0036] Sulfide accelerator 0.05-50mg / L

[0037] The balance is water.

[0038] In this embodiment, nickel chloride, nickel carbonate, nickel nitrate, and nickel hypophosphite can replace nickel sulfate or soluble nickel salt; sodium hypophosphite, potassium hypophosphite, and ammonium hypophosphite can replace sodium hypophosphite.

[0039] Preferably, the mass concentration of the nickel sulfate or soluble nickel salt is 15-35g / L.

[0040] Preferably, the mass concentration of the sodium hypophosphite is 15-40g / L.

[0041] Preferably, the complexing agent is lactic acid or soluble lactate or glycine or soluble glycinate or ...

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Abstract

The invention relates to the technical field of printed wiring board chemical nickel-phosphorus-plated alloys, particularly to a chemical nickel-phosphorus-plated alloy solution and a method for applying the same to a printed wiring board to deposit a nickel-phosphorus alloy. The chemical nickel-phosphorus-plated alloy solution includes organic disulphides and polysulfides and inorganic polysulfides, and specifically contains but is not limited alkyl disulphides and derivatives thereof, thiuram and derivatives thereof, thiazole and derivatives thereof, and thiourea and derivatives thereof. The content of a sulfide accelerator in a chemical nickel plating solution is 0.05 to 50 ppm, can satisfy an actual production nickel depositing rate requirement, can prevent the nickel-phosphorus alloy deposited on a copper-based circuit from diffusion plating or skip plating, and can still keep nickel-phosphorus alloy deposition activity after aging of a bath solution.

Description

technical field [0001] The present invention relates to the field of electroless plating solution, especially to a method that can stabilize the nickel-phosphorus content and crystal form of the plating layer during the service period of the plating solution, reduce the generation of false plating and "black pad", thereby ensuring the plating layer formed during the service period of the plating solution An electroless nickel-phosphorus alloy solution with excellent soldering, wire bonding and electrical conductivity properties and a method for depositing nickel-phosphorus alloy on a printed circuit board. Background technique [0002] Electroless Nickel Immersion Gold (Electroless Nickel Immersion Gold) is an important method for surface treatment of electronic components such as printed circuit boards and ceramic substrates or terminal contact surfaces. , heat dissipation and other assembly requirements. However, when the micro-components in the electroless nickel-phospho...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/24C23C18/36
CPCH05K3/24C23C18/36H05K2203/072H05K2203/0786
Inventor 张杰肖文全白坤生
Owner GUANGDONG LEAR ELECTROCHEM LTD
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