Polyimide composite coating and preparation method thereof and application thereof
A polyimide and composite coating technology, applied in coatings, anti-corrosion coatings, anti-fouling/underwater coatings, etc., can solve the problems of unsuitable on-site construction and cumbersome procedures, and achieve low cost, simple process, combined with good effect
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[0079] Examples 1 to 3:
[0080] In the following three embodiments, the substrate material is a PI / flake graphite (mass ratio 10%, 20%, 30%) composite coating deposited on the surface of a Q235 steel sheet with a thickness of about 2mm, and the coating thickness is ~100μm. The coating and the substrate The material is well combined; the specific preparation method of the PI / graphite composite coating is as follows:
[0081] 1. Weigh 10.002g of 4,4'-diaminodiphenyl ether (ODA), dissolve it in 200ml of N,N-dimethylformamide (DMF), stir to dissolve it completely (5min); then weigh Take 10.906 g of pyromellitic dianhydride (PMDA), add a small amount of multiple times to the above solution and stir; after the addition is complete, continue to stir for 8-10 hours to obtain a polyimide precursor polyamic acid solution;
[0082] 2. Add the additive-flake graphite (20μm in size) to the polyamic acid solution. The mass fractions of flake graphite are 10%, 20%, and 30%, respectively, and ultr...
Example
[0089] Examples 4~6
[0090] In the following three embodiments, the base material is a PI / nano Cu (mass ratio 10%, 20%, 30%) composite coating deposited on the surface of a 316 stainless steel sheet with a thickness of about 2mm, and the coating thickness is -20μm. The coating and the substrate The materials are well combined; the specific preparation method of the PI / Cu composite coating is as follows:
[0091] 1. Weigh 10.002g of 4,4'-diaminodiphenyl ether (ODA), dissolve it in 200ml of N,N-dimethylformamide (DMF), stir to dissolve it completely (5min); then weigh Take 10.906 g of pyromellitic dianhydride (PMDA), add a small amount of multiple times to the above solution and stir; after the addition is complete, continue to stir for 8-10 hours to obtain a polyimide precursor polyamic acid solution;
[0092] 2. Add additive-nano copper (particle size of 300nm) to the polyamic acid solution, the mass fraction of nano copper is 10%, 20%, 30%, respectively, ultrasonic and stirring fo...
Example
[0099] Examples 7-9
[0100] In this embodiment, the base material is a PI / micron Cu (mass ratio 10%, 20%, 30%) composite coating deposited on the surface of a Q345 steel sheet with a thickness of about 1.5mm. The coating thickness is ~200μm. The coating and the base material Good combination; the specific preparation method of the PI / micron Cu composite coating is as follows:
[0101] 1. Weigh 10.002g of 4,4'-diaminodiphenyl ether (ODA), dissolve it in 200ml of N,N-dimethylformamide (DMF), stir to dissolve it completely (5min); then weigh Take 10.906 g of pyromellitic dianhydride (PMDA), add a small amount of multiple times to the above solution and stir; after the addition is complete, continue to stir for 8-10 hours to obtain a polyimide precursor polyamic acid solution;
[0102] 2. Add additive-micron copper (200 mesh) to the polyamic acid solution, the mass fraction of micron copper is 10%, 20%, 30%, respectively, ultrasonic and stirring for 1~2h to finally obtain thermosetting...
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