Corrosion-resistant and highly reflective front mirror with laminated structure and preparation method thereof
A laminated structure, corrosion-resistant technology, applied in optics, optical components, instruments, etc., can solve the problems of weakening reflected energy light absorption, easy to produce damage, weak scratch resistance of the dielectric layer, etc., to achieve clear development and reflection. The effect of high rate and simple preparation process
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Embodiment 1
[0046] as attached figure 1 As shown, a diffusion barrier layer 2 / reflective layer 3 / dielectric layer 4 / scratch-resistant layer 5 is sequentially deposited on a glass substrate 1 by physical vapor phase magnetron sputtering. First put the glass substrate 1 into acetone, absolute ethanol, and deionized water for 20 minutes, and then blow air for 2 hours in a drying oven at a temperature of 80 ° C; then fix it on a rotatable sample stage in a vacuum chamber , use the plasma generated by argon to etch it for 20min, when the vacuum degree of the chamber is less than 4.0×10 -5 Pa, rush into Ar gas and adjust sputtering pressure to 0.3Pa, adjust Ti 50 B 50 Target power density 8.5W / cm 2 , to deposit on the main surface of the glass substrate, the composition is Ti 50 B 50 Diffusion barrier layer 2 with a thickness of 100nm; then adjust the power density of the target Ag to 4.5W / cm 2 , deposit a layer of Ag reflective layer 3 on the diffusion barrier layer 2 with a thickness of...
Embodiment 2
[0048] as attached figure 1 As shown, a diffusion barrier layer 2 / reflective layer 3 / dielectric layer 4 / scratch-resistant layer 5 is sequentially deposited on a glass substrate 1 by physical vapor phase magnetron sputtering. First put the glass substrate 1 into acetone, absolute ethanol, and deionized water for 20 minutes, and then blow air for 2 hours in a drying oven at a temperature of 80 ° C; then fix it on a rotatable sample stage in a vacuum chamber , use the plasma generated by argon to etch it for 15min, when the vacuum degree of the chamber is less than 1×10 -5 Pa, rush into Ar gas and adjust sputtering pressure to 0.5Pa, adjust Ti 40 B 60 Target power density 12W / cm 2 , to deposit on the main surface of the glass substrate, the composition is Ti 40 B 60 Diffusion barrier layer 2 with a thickness of 80nm; then adjust the power density of the target Au to 5.5W / cm 2 , a layer of Au reflective layer 3 is deposited on the diffusion barrier layer 2 with a thickness o...
Embodiment 3
[0050] as attached figure 1 As shown, a diffusion barrier layer 2 / reflective layer 3 / dielectric layer 4 / scratch-resistant layer 5 is sequentially deposited on a glass substrate 1 by physical vapor phase magnetron sputtering. First put the glass substrate 1 into acetone, absolute ethanol, and deionized water for 15 minutes for ultrasonic cleaning, and then blow air for 2 hours in a drying oven at a temperature of 80°C; then fix it on a rotatable sample stage in a vacuum chamber , use the plasma generated by argon to etch it for 20min, when the vacuum degree of the chamber is less than 4.0×10 -5 Pa, rush into Ar gas and adjust sputtering pressure to 0.4Pa, adjust Ti 40 B 60 Target power density 14W / cm 2 , to deposit on the main surface of the glass substrate, the composition is Ti 40 B 60 Diffusion barrier layer 2 with a thickness of 30nm; then adjust the power density of the target Mo to 3.8W / cm 2 , deposit a layer of Mo reflective layer 3 on the diffusion barrier layer 2...
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