Low-temperature type flame retardant epoxy resin adhesive and preparation method thereof

Abstract

The invention discloses a low-temperature type flame retardant epoxy resin adhesive and a preparation method thereof. The preparation method comprises the following steps of mixing epoxy resin, epoxy resin thinner, defoaming agent, and toughener, and uniformly stirring, so as to obtain a component A; mixing phenolic modified amine, accelerant and coupler, and uniformly stirring, so as to obtain a component B; finally, uniformly mixing the raw materials of component A and component B, so as to obtain the low-temperature type flame retardant epoxy resin adhesive. The low-temperature type flame retardant epoxy resin adhesive has the advantages that the phenolic hydroxyl, thiocarbonyl and secondary amino group type low-temperature active groups and the phosphorus-nitrogen synergistic flame retardant elements are contained, so that the low-temperature experiment and halogen-free flame retardant effects are realized; the construction is convenient, the odor is little, the applicable period is long, the heat discharging is stable, the flame retardant property is excellent, the low-temperature and quick-curing effects are realized, the adhering with a substrate is good, and the impact-resistant property is realized; the problems of difficulty in curing and failure to self flame retardancy at low temperature in the existing epoxy resin adhesive are solved, the preparation method is simple, and the control and industrialization are easy.

Description

technical field [0001] The invention relates to an adhesive composite material and a preparation method thereof, in particular to an epoxy resin-based adhesive and a preparation method thereof, a low-temperature adhesive and a preparation method thereof, or a flame-retardant epoxy resin A resin adhesive and a preparation method thereof are applied in the technical field of new adhesive materials. Background technique [0002] Epoxy resin adhesives are widely used because of their excellent low curing shrinkage, cohesiveness, abrasion resistance, electrical insulation, and chemical resistance, and because they are difficult to cure, flammable, and curable at low temperatures. The poor toughness and high brittleness of the material limit its use in some fields with harsh construction conditions. Nowadays, the research and development of epoxy resin adhesives at home and abroad mainly focus on the field of adhesives that can be cured at room temperature and high temperature, b...

AI Technical Summary

Problems solved by technology

[0003] There are many kinds of epoxy resin adhesives. Adhesives used at room temperature and heating can meet most of the market demand. However, in low temperature environments, most of the adhesives on the market are made of polyamines or low molecular thiol compounds. Its disadvantages are obvious, polyamines are easy to volatilize and cause great damage to the human respiratory system, low-molecular thiol compounds have a strong odor, and the cured product is relatively brittle and has poor adhesion

Moreover, its limiting oxygen index (LOI) is only about 17, which is a flammable substance. It is easy to burn when encountering high temperature. During the combustion process, harmful gases such as carbon monoxide will be released, which not only endangers the environment, but also brings people's safety. major hidden danger

However, the efficient and environmentally friendly phosphorus-nitrogen synergistic flame retardant system is still rarely used in the field of epoxy resin adhesives, and its low-temperature curing performance is not ideal, which cannot meet the needs of industry and life.