Check patentability & draft patents in minutes with Patsnap Eureka AI!

Polyamide imide solution, porous polyamide imide film, and methods for producing same

A technology of polyamide-imide film and polyamide-imide, which is applied in the direction of coating, etc., can solve the problems of limited scope of application, and achieve the effect of excellent heat resistance and high porosity

Inactive Publication Date: 2016-08-31
UNITIKA LTD
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in order to produce a thermosetting porous polyimide film, shrinkage of the PI precursor coating film formed on the base material occurs during thermosetting, so the range of application may be limited depending on the situation.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Polyamide imide solution, porous polyamide imide film, and methods for producing same
  • Polyamide imide solution, porous polyamide imide film, and methods for producing same
  • Polyamide imide solution, porous polyamide imide film, and methods for producing same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0070] Hereinafter, examples will be given to further describe the present invention in detail. In addition, this invention is not limited to an Example.

[0071]

[0072] 15 g of PAI powder obtained by copolymerizing TAC, DADE and MDA (copolymerization molar ratio: DADE / MDA=7 / 3) (Torlon 4000T-HV manufactured by Solvay Advanced Polymers, glass transition temperature 280° C.) was dissolved at 30° C. in 25 g of NMP In a mixed solvent composed of 60 g of TEGM, a uniform PAI solution (A-1) having a PAI solid content concentration of 15% by mass relative to the PAI solution and an ether solvent content of 60% by mass relative to the PAI solution was obtained.

[0073] This solution was coated on a corona-discharge-treated PET film (manufactured by Unitika: thickness 100 μm), dried at 130° C. for 30 minutes, and then the coating film was peeled off from the PET film to obtain a porous PAI with a thickness of 50 μm. membrane. Table 1 shows the measurement results of the porosity ...

Embodiment 2～8

[0075] In the same manner as in Example 1, PAI solutions (A-2 to A-8) were produced with the compositions shown in Table 1. A porous PAI membrane was obtained from these solutions under the same conditions as in Example 1. Table 1 shows the porosity measurement results of these porous PAI films.

Embodiment 9

[0077] As the PAI powder, a PAI powder (Torlon AI-10 manufactured by Solvay Advanced Polymers, glass transition temperature 272° C.) obtained by polymerizing TAC and DMA was used, and a PAI solution was prepared in the same manner as in Example 1 (A-9 ). From this solution, a porous PAI membrane was obtained under the same conditions as in Example 1. Table 1 shows the porosity measurement results of the porous PAI film.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Tensile strengthaaaaaaaaaa
Login to View More

Abstract

The present invention provides: a polyamide imide (PAI) solution from which it is possible to obtain a porous PAI film having continuous pores, and exhibiting excellent heat resistance and high porosity; a method for producing the same; a porous PAI film obtained from this solution; and a method for producing the same. A PAI solution containing a nitrogen-containing polar solvent and an ether-based solvent, wherein: the solid-content concentration of the PAI constitutes 25 mass% or less of the mass of the PAI solution; the content of the nitrogen-containing polar solvent constitutes 15 mass% or more of the mass of the PAI solution; and the content of the ether-based solvent constitutes over 30 mass% of the mass of the PAI solution. The method for producing the PAI solution involves dissolving solid PAI in a solvent mixture containing a nitrogen-containing polar solvent and an ether-based solvent. The method for producing the porous PAI film involves coating a substrate with the PAI solution, and thereafter, drying at a temperature of 200 DEG C or less. The porous PAI film is one produced using this method.

Description

technical field [0001] The present invention relates to polyamide-imide solution and its manufacturing method and the porous polyamide-imide membrane that is made by this polyamide-imide solution and its manufacturing method (hereinafter, sometimes polyamide-imide is abbreviated as " PAI"). Background technique [0002] Regarding polyimide-based porous membranes, they are used in industrial materials such as electronic materials, optical materials, separators for lithium secondary batteries, filters, separation membranes, and electric wire coverings by taking advantage of their excellent heat resistance and high porosity. It is widely used in fields such as materials of medical materials. Among polyimide-based porous membranes, the following method has been proposed as a method for producing a thermosetting polyimide (PI) using a polyimide precursor (polyamic acid) as the porous membrane. A PI precursor solution containing an amide solvent and an ether solvent as a solvent...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C08L79/08C08J9/28C08K5/06C08K5/16
CPCC08G73/14C08J3/095C08J3/096C08J2367/02C08J2479/08C09D179/08C08J5/18C08J9/24C08L79/08
Inventor 藤冈直史柴田健太山田宗纪繁田朗细田雅弘越后良彰
Owner UNITIKA LTD
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com